Мероприятия

Список предстоящих мероприятий Agilent в России

 

Компания Agilent Technologies принимает участие в многочисленных выставках и конференциях, а также организует бесплатные технические семинары для своих клиентов. Список мероприятий мы постоянно обновляем.

 

Мероприятия
Название Описание Дата Место проведения Информация
Передовые технологи электромагнитного (ЭМ) моделирования на базе САПР Agilent EMPro и ADS Компания Agilent Technologies является признанным лидером в области разработки систем автоматизированного проектирования (САПР), при этом это единственная компания, которая одновременно занимает лидирующие позиции и в производстве измерительной техники.
На семинаре будет представлен обзор новых решений компании Agilent Technologies в области электромагнитного моделирования с помощью передовых средств проектирования – САПР EMPro и Advanced Design System (ADS).                     

7 февраля
&
9 февраля 
  

Москва

 

Нижний Новгород

 On-line регистрация
X-параметры – эффективный инструмент для анализа нелинейных цепей Компания Agilent Technologies совместно с компанией Maury Microwave приглашает на бесплатный семинар «X-параметры – эффективный инструмент для анализа нелинейных цепей», который состоится 29 февраля 2012 г. в Москве в деловом центре «Кимберли-Лэнд».
На протяжении более 40 лет большинство теоретических и практических задач анализа цепей и компонентов решалось на основе S-параметров.		 29 февраля

Москва

 On-line регистрация

 

Live web seminars
Название Описание Дата Место проведения Информация
Introduction to EMI/EMC Challenges and Their Solution - Part III In the multigigabit era, passing EMI/EMC specs is increasingly challenging. Discovery of an EMI/EMC failure late in the project can force a recourse to makeshift solutions that add unit cost and delay time to market.
In this web seminar, we explain the causes of EMI/EMC and propose a proactive methodology that we dub “Virtual EMI lab.” This methods uses EM simulation to identify and mitigate issues early in the design when many more design options are available. The “Virtual EMI lab” discipline includes both pre-manufacture EM simulations and methodology refinement via post-manufacture co-relation against measured data from EM chambers and EM scans. Our examples include: trace emission from MA/CMD memory, return-current emission on data nets on packages, SSO emission due to Icc(t), and HDMI cable emission due to grounding issues between the connector and the PCB.		 16th February Online Click here 
New High Speed DDR Probing and Analysis Tool The use of BGA probes for probing DDR DRAM is becoming more popular as design gets more complex and compact and data rates get higher. DDR3 and DDR4 data rates are increasing from 800MT/s to possibly 3200MT/s. Memory system designers now have huge concerns on probing meeting the high bandwidth requirement for best signal fidelity and also are in need of analysis tool to ease making measurements. This web seminar describes a new probe correction method used to extend the bandwidth of the DDR BGA probe to provide more margins in testing signal integrity and minimise error introduced by the BGA probe. It also includes analysis tools available today to help make measurements and reduce test cost and time. 22nd February Online Click here
Characterising MIL-STD 1553 and ARINC 429 Serial Bus Networks In this web seminar we will discuss how modern oscilloscopes are able to trigger and automatically decode MIL-STD 1553 and ARINC429 serial buses. We will then show how physical layer characteristics, such as min/max voltage swing, transition times, zero-crossing-distortion, and half bit-widths, can be quickly measured and compared against published electrical specifications. We will conclude with a discussion of how eye-diagram mask testing can be used to quickly perform pass/fail testing. 22nd February Online Click here
New Challenges for UE Developers with Voice Transport Over LTE

With increasing deployment of LTE, and with ever-increasing demands for hi-data throughput, we are witnessing faster transition to an all IP based network. While mobile applications continue to dominate demands on the mobile infrastructure, legacy traffic such as voice and services will provide fresh challenges in extracting deterministic performance from an IP based backbone provided by LTE. The new demands on end-to-end IP data performance will require frequent fallbacks from packet to circuit switched mechanisms, and added complexity in handovers between LTE and 2G/3G/3.5G.

23rd
February

 Online Click here
Introduction to 802.11ac WLAN Technology and Testing The growing popularity of high-definition video and desire for fast streaming and file transfers is driving the need for higher data throughput for WLAN. This web seminar provides an introduction to the new IEEE 802.11ac standard that is under development to address the need for “very high throughput.” Some of the design and test challenges that R&D and test engineers may face as they implement the new features in this standard will also be discussed, and some measurement solutions will be presented.
 		 14th March Online Click here
HSPA+ and LTE: Test Challenges for Device Developers

LTE is “hot”. And so is 2G/3G/3.5G led by HSPA+. Both are getting redefined with new thresholds for high data throughput and an IP based transport. Demands on handset developers are unprecedented as they add more radios, implement the latest 4G wireless technologies seamlessly with legacy 2G/3G and support the performance needs of a multitude of applications.

 15th March Online Click here
Digitiser fundamentals: Design considerations to achieve superior measurements Digitisers are more than banners specs, such as bandwidth and sample rate. There are numbers of important factors that will influence the quality of your signal measurements. Each application and device must be reviewed on a case by case basis, and an an in-depth evaluation of what must be measured, how it can be measured and the required degree of accuracy are necessary. During this web seminar, experts will review digitisers' fundamentals, explain how each building block in various architectures will influence measurements, and help you optimise the quality of your high speed signal measurements. 22nd March Online Click here
Fundamentals of testing RF amplifiers and high-power devices with RF VNA This web seminar describes fundamentals, practical methodologies, and tips for accurately measuring RF amplifiers with the RF VNA. The topics discussed include basic S-parameter measurements for extracting stability factors, P1dB measurements, high-power S-parameter measurements, harmonic distortion measurements, power leveling for the device's input/output signals, and more. 27th March Online Click here
Power Measurements & Analysis using Agilent InfiniiVision 3000 X-Series Oscilloscopes To keep pace with technology trends, many of today’s oscilloscopes offer a range of measurement capabilities specifically designed to characterise switch mode power supplies. In this web seminar we will review some of the basics of switching power supplies and discuss in detail some of the specific power supply measurements that are commonly used in designing and characterising today’s switching power supplies. We will show how Agilent’s new DSOX3PWR Power Measurements option on the InfiniiVision 3000 X-Series oscilloscope can help you characterise switching power supplies automatically, consistently, and fast. Moreover, we will cover probing solutions that can help ensure that the most accurate measurements are performed on your systems. 28th March Online Click here
Reducing cost of test of In-Circuit Test (ICT) for high mix, low volume PCBA In Europe, the electronics industry may see production volumes decrease as a result of belt tightening measures from all sectors. However, electronic manufacturers will still have to roll out new products to drive sales and profit growth. Therefore, optimising manufacturing lines for a higher mix, lower volume component level test environment is crucial in reducing the cost of test. The two elements of test, “just-enough” and “highest coverage” will no longer be separate, but in fact expectations will be that they will meet somewhere in the middle. In addition, managing product mixes on the same test equipment will be a bigger challenge. In this web seminar, we will explore ideas, strategies and alternatives on how to overcome some of these challenges. 29th March Online Click here

Ссылки по теме