Innovations in EDA: Accurate Modeling of Packages and Interconnects
Webcast - recorded | Where & When
An important step in high frequency / high speed IC design is the characterization of IC performance within a realistic environment including packaging, interconnects, connectors, etc. There are several approaches to creating accurate models of these elements, such as creating equivalent circuit models, EM simulations, and measurements. This webcast will compare these different methods and examine the trade-offs of each. Several case studies are presented which compare measured and simulated results.
Where & When
|Price||Date(s)||Location||For more information|
2010-12-02 10:00 — 2010-12-02 11:00
|At Your PC||View the recording of the Dec 2 , 2010 broadcast on|
Prices shown are list prices and are subject to change without notice.
Training & Event Materials
Accurate Modeling of Packages and Interconnects
Innovations in EDA Webcast Series presented on December 2, 2010.
Seminar Materials 2010-12-02
PDF 2.47 MB