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RF Power Amplifier Design Series - Part 2: End-to-End Design and Simulation of Handset PA Modules

1   Hour | Webcast - recorded | Where & When

Why this webcast is important:
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.

Topics discussed include:
• How saturated and linear PA designs have slightly different requirements
• Compact model-based simulation of PA die
• Understanding why process statistics and statistical simulation (of both die and package) are important
• The use of compact HBT models for die design and discussion of common misconceptions regarding the importance of “array” level modeling
• EM simulation of on-chip passives, laminate and package – including process variation and its impact on front-end module performance and yield.

Join us for this practical and informative webcast.

Who should attend:
Target audience is designers, modelers, and design automation working on power amplifier design
 

Where & When

Price Location For more information
Free At Your PC Enroll to view the Mar 1, 2012 recorded broadcast 

Prices shown are list prices and are subject to change without notice.

Training & Event Materials

End-to-End Design and Simulation of Handset Modules 
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.

Seminar Materials 2012-02-27

PDF PDF 1.01 MB