Sprechen Sie mit einem Experten

Technical Support

Electronic Measurement

Find by Product Model Number: Examples: 34401A, E4440A

1-25 of 179

Sort:
Lightwave Tutorial Series on Complex Optical Modulation - Article
Agilent offers a tutorial series on complex optical modulation featured in Lightwave magazine, featuring for example the challenges of coherent signal detection.

Article 2014-05-22

2014 Global PXI Instrumentation Growth Excellence Leadership Award - Article Reprint
Frost & Sullivan honors Agilent as a growth leader in the PXI modular instrumentation market in 2014.

Article 2014-05-22

PDF PDF 598 KB
Demystify MIPI M-PHY receiver physical layer test challenges – Webcast
For design, test and validation engineers who need to characterize and validate compliance of their MIPI designs.

Article 2013-11-15

ECOC 2013 video interview with Stefan Loeffler
Review of the ECOC 2013 Exhibition in London

Article 2013-11-13

Time-domain pulse shaping for increased spectral efficiency - Article
This article elaborates on the conditions needed to prevent the effects of ISI and on the use of different filtering techniques for the purpose of bandwidth and signalcontainment.

Article 2013-11-13

Agilent PCBA Test Award-winning Milestones

Feature Story 2013-10-09

Incremental Redundancy in EGPRS
Incremental redundancy is implemented in EGPRS systems to achieve maximum efficiency in over-the-air interface... WirelessDesignMagazine.com article by Paul Mercy. Feb 2005. Acrobat PDF.

Article 2013-04-02

Ball Grid Array Joint Inspection Using X-ray as it relates to voids and the IPC-7095A specification
With the introduction of Lead-free solder, voiding within Ball Grid Array (BGA) joints is potentially a major issue. This article discusses the relationship to voiding, the IPC standard and Automated X-ray Inspection.

Feature Story 2012-12-06

PDF PDF 105 KB
Choose the right system calibration services for your Agilent i3070/3070 In-circuit Test System
Agilent offer a range of new calibration service with and without system calibration license to use for your Agilent i3070/3070 In-circuit Test System

Case Study 2012-09-28

Improving Coverage for ECU Outliers - Article Reprint
This article explores how to catch electronic faults that typically escape with traditional serial testing, by using a multiple-channel voltage acquisition method that can enable faster parallel test.

Article 2012-08-24

PDF PDF 191 KB
Changes in Test Coverage - Article Reprint
This article discusses challenges behind in-circuit testing on modern-day high speed, high complexity PCBAs, and work-around solutions currently available.

Article 2012-08-24

PDF PDF 235 KB
ICT Total Cost of Ownership - Article Reprint
This article examines how the total cost of ICT ownership continues to change. It discusses the factors that a manufacturer should consider before making an investment.

Article 2012-08-24

PDF PDF 294 KB
The Value of the in-Circuit Tester - Article Reprint
This article discusses how in-circuit testers for PCBAs can play a significant role to enhance product value and increase production efficiency for electronics manufacturers.

Article 2012-08-24

PDF PDF 1.04 MB
Expanding Coverage with Boundary Scan - Article Reprint
Limited access tests can expand or leverage on boundary scan and provide more test coverage for a myriad of devices, beyond just boundary scan device coverage.

Article 2012-08-24

PDF PDF 206 KB
Comparing In-house and Commercial Load Solutions for Automotive Test

Article 2012-07-17

Boundary-Scan Advanced Diagnostic Methods
This paper illustrates how usage of boundary scan circuit information and predictive analysis of potential assembly faults will provide more precise and accurate diagnostic information.

Article 2012-04-17

PDF PDF 1.20 MB
Testing DDR Memory; How On-Chip DFT Helps
This paper discusses DDR memory testing challenges we see today, and how the adoption of DFT capabilities pays off in higher test coverage, better diagnostics and reduced programming/support time.

Article 2012-04-17

PDF PDF 530 KB
High-Speed Data Throughput Test
Ensure a quality user experience by fully testing the packet data performance of your wireless device early in the design cycle. The 8960 offers the highest 2G/3G/3.5G data rates and real-world testing to find issues sooner and resolve them faster!

Feature Story 2011-11-29

In-Circuit Test (ICT): The King Is Dead; Long Live the King!
Reports of the demise of in-circuit testing have been exaggerated for at least 20 years. Despite this, ICT is still here and kicking. This paper discusses various reasons why the King lives on.

Article 2011-11-04

PDF PDF 67 KB
Surviving State Disruptions Caused by Test: A Case Study - Article Reprint
This paper discusses new instructions for IEEE 1149.1 boundary scan tests that can remove "lobotomy problems" during tests.

Article 2011-11-04

PDF PDF 338 KB
Defect Coverage of Boundary-Scan Tests - Article Reprint
This paper discusses the potential and challenges with some defects when using the "PCOLA/SOQ" metric model in boundary scan test coverage.

Article 2011-11-04

PDF PDF 245 KB
Test Coverage: What Does It Mean when a Board Test Passes? - Article Reprint
Defining board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage. This paper explores an alternative 'defect universe' to better depict test coverage.

Article 2011-10-27

PDF PDF 89 KB
A New Probing Technique for High-Speed/High-Density Printed Circuit Boards - Article Reprint
This paper discusses how in-circuit test access can be maintained, even on highly dense gigabit logic boards.

Article 2011-10-24

PDF PDF 341 KB
ICT Boundary Scan Development Steps - Article Reprint
This paper discusses how test point access and good data can make a big difference in the success of your boundary scan test. Best practises for boundary scan test development are also highlighted.

Article 2011-08-08

PDF PDF 411 KB
A Primer on Test Options - Article Reprint
This paper discusses why ICT remains the best option for high-volume electronics manufacturing, with its flexibility to provide a myriad of test options to meet different manufacturing needs.

Article 2011-08-08

PDF PDF 269 KB

1 2 3 4 5 6 7 8 Next