Contact an Expert

Technical Support

Test & Measurement

Find by Product Model Number: Examples: 34401A, E4440A

Refine the List

remove all refinements

By Application

By Type of Content

By Product Category

1-25 of 38

Sort:
Agilent EEsof EDA Newsletter - Product and Application News
Keep tabs on the latest product and application news and review the archives of the Agilent EEsof EDA Newsletter.

Newsletter 2013-05-14

Model Builder Program (MBP)
MBP is a one-stop solution that provides both automation and flexibility for silicon device modeling.

Brochure 2013-04-10

PDF PDF 1.76 MB
Model Quality Assurance (MQA)
MQA provides the complete solution and framework to fabless design companies, IDMs, and foundries for SPICE model library validation, comparison, and documentation.

Brochure 2013-04-10

PDF PDF 1.40 MB
EDA Support Services
Agilent Support Services for EDA Products offers customers several benefits otherwise not available. This service is designed to help you get the most out of your software purchases.

Brochure 2013-04-09

PDF PDF 128 KB
Agilent Ships Newest SPICE Model Extraction and Qualification Software
Agilent announces shipment of the latest release of its industry-leading SPICE model extraction tool, Model Builder Program, and SPICE qualification tool, Model Quality Assurance.

Press Materials 2013-03-13

Agilent Technologies Launches Recognition Program for EDA Experts
Agilent launches its Agilent Certified Expert recognition program for EDA experts. Eligible participants include individuals demonstrating a high level of expertise-both theoretical and practical-in applying Agilent EEsof EDA tools for product design and modeling.

Press Materials 2013-03-12

Agilent embraces GaN modeling in IC-CAP upgrade
EETimes Design Article highlights new capabilities in IC-CAP 2013.01.

Article 2013-01-09

IC-CAP Device Modeling Software
Technical overview of Agilent's Integrated Circuit Characterization and Analysis Program (IC-CAP), complete and accurate parameter extraction for semiconductor device modeling

Technical Overview 2012-12-20

PDF PDF 1.98 MB
Languages 
Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
Agilent announces the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).

Press Materials 2012-12-18

MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
Experts Share Insight on Compact Device Modeling with Emphasis on Simulation-Aware Models.

Press Materials 2012-12-12

Pulsed Measurement of Active Device IV Characteristics and S-Parameters - Maury Microwave
Pulsed Measurement of Active Device IV Characteristics and S-Parameters from Maury Microwave and Agilent

Solution Brief 2012-12-04

Future Device Modeling Trends
Modeling the nonlinear device (basic nonlinear component) for circuit and system simulation downstream.

Article 2012-11-28

PDF PDF 6.08 MB
X-Parameter Design Simulation Models - Modelithics
X-Parameter Design Simulation Models from Modelithics and Agilent.

Solution Brief 2012-10-02

Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.

Press Materials 2012-08-23

Agilent Extends Partnership with AMCAD to Include Nonlinear Modeling and Measurement Services
Agilent announces that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.

Press Materials 2012-06-19

Agilent to Demonstrate Its Newest RF/Microwave Design and Test Products at IMS
Agilent will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2012 IEEE MTT-S International Microwave Symposium (Booth 1015), June 17-22, at the Palais des congrès de Montréal.

Press Materials 2012-06-04

Agilent Announces Shipment of the IC-CAP 2012 Platform for Device Characterization and Modeling
Agilent announces shipment of the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP) for 2012.

Press Materials 2012-03-02

Agilent Completes Acquisition of Accelicon Technologies’ Solutions for Semiconductor Device Modeling
Agilent Technologies announced that Accelicon Technologies’ software solutions and technology for device-level modeling and validation in the electronics industry are now part of Agilent.

Press Materials 2012-02-21

Pulsed Measurement of IV Characteristics and RF Parameters – Auriga Microwave
Pulsed Measurement of IV Characteristics and RF Parameters from Auriga Microwave and Agilent

Solution Brief 2012-02-10

Agilent EEsof EDA Premier Communications Design Software
Agilent EEsof EDA premier communications design software product overview brochure.

Brochure 2011-08-03

PDF PDF 1.92 MB
Agilent Technologies Ships Latest IC-CAP Platform for DC and RF Device Characterization and Modeling
Software improves modeling flow with link between measurement and extraction

Press Materials 2011-05-10

Automated Measurement with IC-CAP
This application note describes a seamless solution for automated measurement and parameter extraction with Agilent IC-CAP

Application Note 2011-01-10

PDF PDF 1.42 MB
Languages 
Recommended Modeling Configurations for Device Modeling
IC-CAP Recommended Modeling Configurations for Device Modeling

Configuration Guide 2010-09-23

Agilent Introduces IC-CAP WaferPro Software for Automating Complex Device Modeling Applications
IC-CAP WaferPro provides a multi-site, multi-wafer, automated DC and RF measurement solution for semiconductor device modeling applications.

Press Materials 2010-08-19

Compact Hierarchical Bipolar Transistor Modeling with HiCUM
An international series on advances in solid state electronics and technology by Michael Schroter and Anjan Chakravorty.

Promotional Materials 2010-08-01

PDF PDF 330 KB

1 2 Next