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Incremental Redundancy in EGPRS
Incremental redundancy is implemented in EGPRS systems to achieve maximum efficiency in over-the-air interface... WirelessDesignMagazine.com article by Paul Mercy. Feb 2005. Acrobat PDF.

Article 2013-04-02

Ball Grid Array Joint Inspection Using X-ray as it relates to voids and the IPC-7095A specification
With the introduction of Lead-free solder, voiding within Ball Grid Array (BGA) joints is potentially a major issue. This article discusses the relationship to voiding, the IPC standard and Automated X-ray Inspection.

Feature Story 2012-12-06

PDF PDF 105 KB
Choose the right system calibration services for your Agilent i3070/3070 In-circuit Test System
Agilent offer a range of new calibration service with and without system calibration license to use for your Agilent i3070/3070 In-circuit Test System

Case Study 2012-09-28

The Value of the in-Circuit Tester - Article Reprint
This article discusses how in-circuit testers for PCBAs can play a significant role to enhance product value and increase production efficiency for electronics manufacturers.

Article 2012-08-24

PDF PDF 1.04 MB
Changes in Test Coverage - Article Reprint
This article discusses challenges behind in-circuit testing on modern-day high speed, high complexity PCBAs, and work-around solutions currently available.

Article 2012-08-24

PDF PDF 235 KB
ICT Total Cost of Ownership - Article Reprint
This article examines how the total cost of ICT ownership continues to change. It discusses the factors that a manufacturer should consider before making an investment.

Article 2012-08-24

PDF PDF 294 KB
Improving Coverage for ECU Outliers - Article Reprint
This article explores how to catch electronic faults that typically escape with traditional serial testing, by using a multiple-channel voltage acquisition method that can enable faster parallel test.

Article 2012-08-24

PDF PDF 191 KB
Expanding Coverage with Boundary Scan - Article Reprint
Limited access tests can expand or leverage on boundary scan and provide more test coverage for a myriad of devices, beyond just boundary scan device coverage.

Article 2012-08-24

PDF PDF 206 KB
Comparing In-house and Commercial Load Solutions for Automotive Test

Article 2012-07-17

Testing DDR Memory; How On-Chip DFT Helps
This paper discusses DDR memory testing challenges we see today, and how the adoption of DFT capabilities pays off in higher test coverage, better diagnostics and reduced programming/support time.

Article 2012-04-17

PDF PDF 530 KB
Boundary-Scan Advanced Diagnostic Methods
This paper illustrates how usage of boundary scan circuit information and predictive analysis of potential assembly faults will provide more precise and accurate diagnostic information.

Article 2012-04-17

PDF PDF 1.20 MB
Agilent PCBA Test Award-winning Milestones

Feature Story 2012-03-13

High-Speed Data Throughput Test
Ensure a quality user experience by fully testing the packet data performance of your wireless device early in the design cycle. The 8960 offers the highest 2G/3G/3.5G data rates and real-world testing to find issues sooner and resolve them faster!

Feature Story 2011-11-29

Surviving State Disruptions Caused by Test: A Case Study - Article Reprint
This paper discusses new instructions for IEEE 1149.1 boundary scan tests that can remove "lobotomy problems" during tests.

Article 2011-11-04

PDF PDF 338 KB
In-Circuit Test (ICT): The King Is Dead; Long Live the King!
Reports of the demise of in-circuit testing have been exaggerated for at least 20 years. Despite this, ICT is still here and kicking. This paper discusses various reasons why the King lives on.

Article 2011-11-04

PDF PDF 67 KB
Defect Coverage of Boundary-Scan Tests - Article Reprint
This paper discusses the potential and challenges with some defects when using the "PCOLA/SOQ" metric model in boundary scan test coverage.

Article 2011-11-04

PDF PDF 245 KB
Test Coverage: What Does It Mean when a Board Test Passes? - Article Reprint
Defining board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage. This paper explores an alternative 'defect universe' to better depict test coverage.

Article 2011-10-27

PDF PDF 89 KB
A New Probing Technique for High-Speed/High-Density Printed Circuit Boards - Article Reprint
This paper discusses how in-circuit test access can be maintained, even on highly dense gigabit logic boards.

Article 2011-10-24

PDF PDF 341 KB
LED Measurement Options at ICT - Article Reprint
This paper reviews current methods and constraints of LED color testing methodologies.

Article 2011-08-08

PDF PDF 306 KB
A Primer on Test Options - Article Reprint
This paper discusses why ICT remains the best option for high-volume electronics manufacturing, with its flexibility to provide a myriad of test options to meet different manufacturing needs.

Article 2011-08-08

PDF PDF 269 KB
Successful ICT Boundary Scan Implementation - Article Reprint
This paper details eight steps which can help you get the best possible boundary scan test coverage with your i3070 in-circuit tester.

Article 2011-08-08

PDF PDF 111 KB
ICT Boundary Scan Development Steps - Article Reprint
This paper discusses how test point access and good data can make a big difference in the success of your boundary scan test. Best practises for boundary scan test development are also highlighted.

Article 2011-08-08

PDF PDF 411 KB
In-circuit test – Still standing strong
Nay-sayers who about a decade ago started doubting the viability of in-circuit test should look at the thriving sub-ecosystem that is supporting this manufacturing test stalwart.

Article 2011-03-11

PDF PDF 294 KB
In-Circuit Tester - N5747A High-Power Power Supply - Case Study
This paper discusses the first successful implementation of the Agilent N5747A high-power power supply on a customer product - a networking board project.

Case Study 2011-02-11

PDF PDF 1.12 MB
Programming In-System versus Offline-Article Reprint
Is offline programming or ISP at in-circuit test better? One key consideration is the cost of each method. This paper looks at pros and cons of these two methods contributing to the overall costing.

Article 2011-01-13

PDF PDF 159 KB

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