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Test et mesure électronique

Recherche par numéro de modèle du produit: Exemples : 34401A, E4440A

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VTEP Coverage Analysis
How much additional coverage can you really get with VTEP? The VTEP Coverage Analysis Tool provides a realistic estimate.

Notes d’application 2004-10-04

Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

Article 2004-10-01

Safeguard and Low Voltage
Documents summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

Notes d’application 2004-08-30

The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

Notes d’application 2004-08-20

PDF PDF 260 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

Notes d’application 2004-08-08

PDF PDF 102 KB
CCGA Lead-Free Study
Reliability Testing and Data Analysis of an 1657CCGA (Ceramic Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards).

Matériel de promotion 2004-06-04

PDF PDF 480 KB
Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

Étude de cas 2004-05-26

PDF PDF 53 KB
Vectorless Test EP (VTEP) Goes Head-to-Head with Agilent TestJet
In beta tests, VTEP proved its abilities to improve in-circuit test coverage by over 80 percent compared to Agilent TestJet, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.

Étude de cas 2003-12-16

PDF PDF 351 KB
3070 05.31: PDU/POD Upgrade
Describes how to install the E1135C PDU and Pod upgrade.

Manuel d’installation 2003-12-01

PDF PDF 670 KB
Medalist Quality Tool Datasheet
AQT provides statistical quality control and statistical process control analysis for Agilent test systems.

Fiche signalétique 2003-11-01

PDF PDF 626 KB
Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Agilent to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

Étude de cas 2003-10-24

PDF PDF 600 KB
3070 05.31: DUT Power Supply Installation
Describes how to install device-under-test power supplies in the 3070 system.

Manuel d’installation 2003-10-01

PDF PDF 4.53 MB
Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.

Article 2003-10-01

Agilent Quality Tool Dashboards
Dashboards are preprogrammed targeted views that perform specific functions within the AQT software.

Présentation technique 2003-09-30

Agilent Quality Tool Testimonials
Learn what users have to say about Agilent Quality Tool.

Étude de cas 2003-09-30

ScanWorks Reduces Vivace Networks' ICT Costs and Improves Board Quality
This paper discusses how Vivace Networks uses ScanWorks at the benchtop and at in-circuit test to reduce test costs and accelerate time to market in a competitive environment.

Étude de cas 2003-07-31

PDF PDF 29 KB
Test Coverage: What Does It Mean when a Board Test Passes?
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.

Notes d’application 2003-07-28

PDF PDF 266 KB
Intelligent Test Framework Software Solutions
Agilent's Intelligent Test Framework (ITF) and it's associated SQC / SPC and repair solutions, are optimized to work with Agilent testers enabling you to achieve your quality targets at a lower cost-per-assembly.

Présentation technique 2003-07-25

PDF PDF 396 KB
Lucent Demonstrates how ScanWorks for the Agilent 3070 Can Save Nearly $1 Million Per Year
Lucent has demonstrated that reusing ScanWorks boundary-scan tests on the 3070 ICT platform can produce dramatic cost savings through lower test development and fixture costs without giving up test coverage.

Étude de cas 2003-07-23

PDF PDF 222 KB
Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.

Article 2003-07-01

Motorola Drives Reliability and Productivity of In-Car Safety Systems with the Agilent 3070
To maintain rigorous testing without hindering assembly line productivity, Motorola chose the Agilent 3070 In-circuit Test System.

Étude de cas 2003-06-03

PDF PDF 2.01 MB
3070 05.31: Data Formats (Windows)
Describes the types of data files in the 3070 system.

Manuel de l'utilisateur 2003-06-01

PDF PDF 2.72 MB
3070 05.31: System Installation Manual (Windows)
Describes how to install the 3070 system (MS Windows version).

Manuel d’installation 2003-06-01

PDF PDF 2.48 MB
3070 05.31: Syntax Reference (Windows)
Describes the syntax of all programming statements used in the 3070 system.

Manuel de l'utilisateur 2003-06-01

PDF PDF 7.60 MB
3070 05.31: Optional Board Test Applications (Windows)
Describes optional test techniques on the 3070 system.

Manuel de l'utilisateur 2003-05-01

PDF PDF 3.59 MB

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