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Medalist 3070 and Medalist i5000 System Recovery using Retrospect Express
This app note describes how to perform backups of the system hard disk for the Agilent Medalist 3070 and Agilent Medalist i5000 In-circuit Test systems that have been shipped with Retrospect Express 7.0 and Roxio Digital Media Plus 7.2 software.

Application Note 2007-07-10

PDF PDF 628 KB
Limited Access Testing
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, July 2007.

Article 2007-07-01

PDF PDF 137 KB
The Power of Real-Time and Remote Information
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, May 2007.

Article 2007-05-01

PDF PDF 147 KB
Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

Application Note 2007-04-17

PDF PDF 227 KB
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Creating a Quality Early warning System for Outsourced PCBA Operations
This digitally recorded joint paper by Agilent Technologies and Sigmaquest, originally presented at CircuiTree Live in November 2007, offers the audience some strategies to drive operational cost savings.

Feature Story 2007-03-14

Agilent Medalist i3070 07.00p Software Release
The Agilent Medalist i3070 In-circuit test 07.00p software adds new test throughput enhancements in test development and debug as well as in test execution. .

Release Notes 2007-02-21

PDF PDF 93 KB
Quad Flat No-Lead (QFN) Application Note and Best Practices
This document provides details on QFN component test methodology and best practices to ensure robust testing and quality results. The QFN algorithm was introduced in 5DX software version 8.4, and enhanced and simplified in patch version 8.4.1.

Application Note 2007-01-31

PDF PDF 1.05 MB
Medalist i3070 In-Circuit Test System
Product Specification for the Agilent Medalist i3070 is the next generation In-Circuit Test System (ICT).

Data Sheet 2007-01-23

PDF PDF 444 KB
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Medalist i3070 In-Circuit Test Platform
Agilent Medalist i3070 is the next generation In-Circuit Test System (ICT) that provides significant return of investment with unparalleled test coverage and robustness.

Brochure 2007-01-10

PDF PDF 1.18 MB
Implementation of Solder-bead Probing in High Volume Manufacturing
Copyright © 2006 IEEE. This material is posted here with permission of the IEEE. Reprinted from ITC International Test Conference, Paper 5.4.

Application Note 2006-10-25

PDF PDF 844 KB
Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards
Bead probes were used to obtain additional test access on a high-density production printed circuit board. This case study includes practical information and key bead-specific learnings discovered during the process of outsourcing.

Application Note 2006-10-24

PDF PDF 723 KB
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Bead Probes In Practice
Copyright © 2005 IEEE. This material is posted here with permission of the IEEE. Reprinted from ITC International Test Conference, Paper 26.2.

Application Note 2006-10-24

PDF PDF 2.20 MB
Bead Probe Technology Flash Demonstration
View how bead probe technology works.

Demo 2006-10-23

Medalist Bead Probe Technology Product Overview
Proven technology for placing test targets directly on printed circuit board signal traces.

Technical Overview 2006-10-01

PDF PDF 266 KB
Languages 
i5000 06.02p Software
The Agilent Medalist i5000 In-circuit test 06.02p adds intelligent Vectorless Test Extended Performance (iVTEP) to the software.

Release Notes 2006-09-01

“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

Application Note 2006-02-07

PDF PDF 44 KB
Putting Pb-Free to the Test - Why AOI and SPI are vital to upfront process control and verification.
Written by Stig Oresjo, Thorsten Niermeyer & Stacy Johnson, Agilent Technologies. Article published in Circuits Assembly, May 2005.

Article 2005-12-05

PDF PDF 74 KB
Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.

Article 2005-12-05

PDF PDF 75 KB
Characterizing new soldering processes – An experimental methodology for process optimization
Written by Glen Leinbach and Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, July 2005

Article 2005-12-05

PDF PDF 65 KB
Overcoming Lower Wetting Forces of Lead-Free Alloys
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, March 2005.

Article 2005-12-05

PDF PDF 77 KB
Pb-Free PCB Finishes for ICT - New solders can mean new finishes. How to decide which is best.
Written by Stig Oresjo and Chris Jacobsen, Agilent Technologies. Article published in Circuits Assembly, September 2005.

Article 2005-12-05

PDF PDF 88 KB
Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.

Article 2005-12-05

PDF PDF 57 KB
Lead-Free Cost Savings Analysis
This cost-savings calculator shows savings when deploying test on lead-free, as well as VTEP cost savings when compared to TestJet.

Application Note 2005-09-09

XLS XLS 39 KB
Study and Recommendations Into Using Lead Free PCBs at In-Circuit Test
ICT relies on good contact between the test probe and test pad. On OSP boards, it is important that the stencil allows solder paste to be applied to testpoints.

Promotional Materials 2005-06-09

PDF PDF 214 KB
In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

Application Note 2005-05-25

PDF PDF 172 KB

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