Contact an Expert

Technical Support

Test & Measurement

Find by Product Model Number: Examples: 34401A, E4440A

Refine the List

remove all refinements

By Application

By Type of Content

76-96 of 96

Sort:
Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

Case Study 2004-05-26

PDF PDF 53 KB
Vectorless Test EP (VTEP) Goes Head-to-Head with Agilent TestJet
In beta tests, VTEP proved its abilities to improve in-circuit test coverage by over 80 percent compared to Agilent TestJet, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.

Case Study 2003-12-16

PDF PDF 351 KB
Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Agilent to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

Case Study 2003-10-24

PDF PDF 600 KB
Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.

Article 2003-10-01

Agilent Quality Tool Testimonials
Learn what users have to say about Agilent Quality Tool.

Case Study 2003-09-30

ScanWorks Reduces Vivace Networks' ICT Costs and Improves Board Quality
This paper discusses how Vivace Networks uses ScanWorks at the benchtop and at in-circuit test to reduce test costs and accelerate time to market in a competitive environment.

Case Study 2003-07-31

PDF PDF 29 KB
Lucent Demonstrates how ScanWorks for the Agilent 3070 Can Save Nearly $1 Million Per Year
Lucent has demonstrated that reusing ScanWorks boundary-scan tests on the 3070 ICT platform can produce dramatic cost savings through lower test development and fixture costs without giving up test coverage.

Case Study 2003-07-23

PDF PDF 222 KB
Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.

Article 2003-07-01

Motorola Drives Reliability and Productivity of In-Car Safety Systems with the Agilent 3070
To maintain rigorous testing without hindering assembly line productivity, Motorola chose the Agilent 3070 In-circuit Test System.

Case Study 2003-06-03

PDF PDF 2.01 MB
ScanWorks Completes Successful Assessment at Jabil Circuit
One of the first places electronics manufacturers look to reduce expenses is through the elimination of redundant effort.

Case Study 2003-03-21

PDF PDF 661 KB
AwareTest xi Case Study #3
This case study compares fault coverage of the current test strategy (automatic optical inspection/full in-circuit test) with a combined x-ray inspection/simplified in-circuit test strategy.

Case Study 2003-02-15

PDF PDF 164 KB
AwareTest xi Case Study #2
This case study compares the current test strategy with a full combined test strategy and a simplified combined test strategy (x-ray inspection followed by simplified in-circuit test).

Case Study 2003-02-15

PDF PDF 763 KB
AwareTest xi Case Study #1
This case study compares a fully-probed in-circuit test on a conventional high node count test system with a combined x-ray/in-circuit test strategy, using the simplified in-circuit test.

Case Study 2003-02-15

PDF PDF 127 KB
Advanced Energy Industries, Inc. Adopts 3070 In-Circuit Test with MS Windows OS
The stakes were high, but the upside benefits of PC-based test were hard to ignore. Here's how one company made the move.

Case Study 2002-07-17

PDF PDF 363 KB
Charting a DFT Course for Limited Access Boards
Written by Stig Oresjo and Barry Odbert. Published with permission from SMT Magazine, June 2002.

Article 2002-06-01

PDF PDF 143 KB
Notebook Manufacturer Finds Margins in the Details
Design-for-manufacturing methods and an automated test environment help FIC control costs, improve product quality, and protect its margins.

Case Study 2002-02-07

PDF PDF 457 KB
New Test Strategy for Tomorrow's Manufacturing
Written by Mark Terry, Agilent Technologies. Published with permission from Circuits Assembly, August 2000.

Article 2000-08-01

PDF PDF 119 KB
Complementary Test Strategies on High-Complexity Boards
Written by Amit Verma, Mark Ogden and John Kokoska, of Celestica Inc. Published with permission from Circuits Assembly, August 2000.

Article 2000-08-01

PDF PDF 92 KB
Streamlining Test For A Competitive Marketplace
The market price for telephones has dropped ten per-cent each year over the last ten years. To stay competitive, Landis & Gyr Communications, a manufacturer of public telephones, must produce reliable phones faster, with more features for less money.

Case Study 2000-04-01

PDF PDF 98 KB
In-Circuit Testing of High Node Count Boards--Bigger is Not Always Better
The in-circuit test (ICT) engineer faces serious financial and technical challenge when testing more than 3500 nodes.

Case Study 2000-02-01

PDF PDF 77 KB
Tackling Advanced Technology Boards: Combining X-ray and ICT
Written by By Ed Crane, Ed Kinney and Bill Jeffrey. Printed with permission from Circuits Assembly, September 1999.

Article 1999-09-01

PDF PDF 890 KB

Previous 1 2 3 4