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Time Domain Reflectometry Theory - Application Note
When compared to other measurement techniques, time domain reflectometry provides a more intuitive and direct look at the DUT's characteristics.

Application Note 2013-05-31

Impedance and Network Analysis Application List Application Note
This document provides the information of unique and new solutions for impedance and network analysis with using Agilent impedance analyzers, LCR meters and ENA series network analyzers.

Application Note 2012-10-30

PDF PDF 1.11 MB
Using a Network and Impedance Analyzer to Evaluate 13.56 MHz RFID Tags and Readers/Writers
For engineers who work in RFID antenna design and test, this note discusses testing RFID antenna characteristics such as impedance and resonant-frequency with network and impedance analyzers.

Application Note 2012-02-08

How to build a fixture for use with the Agilent Cover-Extend Technology
Cover-Extend Technology is Agilent’s latest limited access solution for in-circuit test. This paper documents the necessary information for a fixture vendor to build a Cover-Extend fixture.

Application Note 2011-06-24

PDF PDF 1.09 MB
Medalist i3070 In Circuit Test – Utilizing the most comprehensive Limited Access
This article introduces the seven most prominent and effective limited access tools on the Agilent Medalist i3070 ICT, collectively known Super 7 suite.

Application Note 2009-03-06

PDF PDF 342 KB
Non-Contact Measurement Method for 13.56 MHz RFID Tags Using the ENA/ENA-L Network Analyzer
For engineers working in RFID antenna design and test, this note discusses a non-contact method for measuring resonant frequencies of RFIDs using a network analyzer.

Application Note 2009-02-20

PDF PDF 199 KB
High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.

Application Note 2008-04-30

PDF PDF 67 KB
Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

Application Note 2007-04-17

Life and Stability of the Agilent 5DX Sealed X-ray Tube
Agilent has developed a sealed ultra-high vacuum X-ray tube that provides stable output throughout a significantly long life.

Application Note 2007-01-22

PDF PDF 78 KB
Considerations for Surface Map Setup
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.

Application Note 2006-08-08

SEMI S2 Standard Modifications for Agilent 3070 and Related Equipment
This document describes three items pertaining to the Agilent 3070 and the SEMI S2 standard. Each of them is related to a variance with the SEMI standard.

Application Note 2006-06-15

PDF PDF 52 KB
AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications

Application Note 2006-04-16

PDF PDF 291 KB
“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

Application Note 2006-02-07

PDF PDF 44 KB
How to Get the Most from Agilent's Intelligent Yield Enhancement Test (IYET)
This paper describes how to get the most from IYET for Agilent board test systems.

Application Note 2005-07-15

Design Considerations for PC Board Carriers for Use in the Agilent 5DX
There are several reasons why it may be necessary or desirable to use a carrier to transport printed circuit assemblies through the 5DX. This paper discusses these and some considerations for the design of suitable carriers.

Application Note 2005-07-13

PDF PDF 918 KB
AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.

Application Note 2005-06-21

In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

Application Note 2005-05-25

PDF PDF 172 KB
Gauge Repeatability on 5DX X-ray System
Summary of 5DX repeatability capability, factors that influence the repeatability capabilities of the 5DX, impacts to gauge repeatability and reproducibility (GR&R) results.

Application Note 2005-03-09

PDF PDF 102 KB
Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

Application Note 2005-02-22

PDF PDF 421 KB
Testing FPGullwing Misalignment Across the Pad
A technique is described which enables detection of misalignment of gullwing joints across the joint using duplicate components and FPGullwing Misalignment.

Application Note 2004-12-08

PDF PDF 1.58 MB
Handling Surface Mapping with Varying Board Construction
This paper describes a method for dealing with lot-to-lot or supplier-to-supplier variations in board construction. Often the variations in board construction result in different color boards which otherwise cause problems with surface mapping.

Application Note 2004-12-02

PDF PDF 1.02 MB
Understanding the PCAP Polarity Reject Signal
This paper describes the algorithm used to determine if polarized capacitors are properly oriented.

Application Note 2004-12-02

PDF PDF 1.09 MB
Understanding and Configuring the 5DX Selftest and Black/White Level Tests
This paper discusses the theory and practice of 5DX automatic compensation tools, Selftest and gray level correction.

Application Note 2004-12-01

PDF PDF 158 KB
How and Why: Confirmation and Adjustments
This paper describes the process of and reason for periodic adjustment of a 5DX system using the confirmation and adjustment panel.

Application Note 2004-12-01

PDF PDF 636 KB
5DX Virus Protection Software Policy
Agilent recognizes that customers require data protection for their PC workstations and computer controlled manufacturing equipment such as the 5DX Test System and associated workstations.

Application Note 2004-08-26

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