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使用 i1000D SFP 在线测试系统测试汽车保险丝盒
使用 i1000D SFP 在线测试系统测试汽车保险丝盒

应用说明 2014-07-17

脱机测试与在线测试之争 : ICT 在线自动测试系统渐占上风
脱机测试与在线测试之争 : ICT 在线自动测试系统渐占上风

应用说明 2014-07-02

High Precision Time Domain Reflectometry - Application Note
Time domain reflectometry (TDR) is a well-established technique for verifying the impedance and quality of signal pats in components, interconnects, and transmission lines.

应用说明 2014-01-23

Modifying DDR Libraries for Silicon Nail Test Generation on the Agilent x1149 Boundary Scan Analyzer
This application note describes how to modify DDR libraries to generate silicon nails tests on the Agilent x1149 Boundary Scan Analyzer.

应用说明 2013-11-07

PDF PDF 382 KB
Releasing the “Test Sequence” and “Test” to Production on the Agilent x1149 Boundary Scan Analyzer
This application note describes how to release test sequences and tests to production when using the Agilent x1149 Boundary Scan Analyzer.

应用说明 2013-10-18

PDF PDF 523 KB
Time Domain Reflectometry Theory - Application Note
When compared to other measurement techniques, time domain reflectometry provides a more intuitive and direct look at the DUT's characteristics.

应用说明 2013-05-31

Impedance and Network Analysis Application List Application Note
This document provides the information of unique and new solutions for impedance and network analysis with using Agilent impedance analyzers, LCR meters and ENA series network analyzers.

应用说明 2012-10-30

PDF PDF 1.11 MB
使用网络和阻抗分析仪评测13.56 MHz RFID 标签和阅读器/记录器
本应用指南面向从事 RFID 天线设计和测试的工程师,探讨了如何使用网络分析仪和阻抗分析仪测试 RFID 天线特征,例如阻抗和谐振频率。

应用说明 2012-06-08

How to build a fixture for use with the Agilent Cover-Extend Technology
Cover-Extend Technology is Agilent’s latest limited access solution for in-circuit test. This paper documents the necessary information for a fixture vendor to build a Cover-Extend fixture.

应用说明 2011-06-24

PDF PDF 1.09 MB
Medalist i3070 In Circuit Test – Utilizing the most comprehensive Limited Access
This article introduces the seven most prominent and effective limited access tools on the Agilent Medalist i3070 ICT, collectively known Super 7 suite.

应用说明 2009-03-06

PDF PDF 342 KB
Non-Contact Measurement Method for 13.56 MHz RFID Tags Using the ENA/ENA-L Network Analyzer
For engineers working in RFID antenna design and test, this note discusses a non-contact method for measuring resonant frequencies of RFIDs using a network analyzer.

应用说明 2009-02-20

PDF PDF 199 KB
High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.

应用说明 2008-04-30

PDF PDF 67 KB
Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

应用说明 2007-04-17

SEMI S2 Standard Modifications for Agilent 3070 and Related Equipment
This document describes three items pertaining to the Agilent 3070 and the SEMI S2 standard. Each of them is related to a variance with the SEMI standard.

应用说明 2006-06-15

PDF PDF 52 KB
“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

应用说明 2006-02-07

PDF PDF 44 KB
How to Get the Most from Agilent's Intelligent Yield Enhancement Test (IYET)
This paper describes how to get the most from IYET for Agilent board test systems.

应用说明 2005-07-15

AXI and Lead-Free Process Characterization
How to use Automated X-ray Inspection as a tool to characterize new lead-free soldering processes.

应用说明 2005-06-21

In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

应用说明 2005-05-25

PDF PDF 172 KB
Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

应用说明 2005-02-22

PDF PDF 421 KB
5DX Virus Protection Software Policy
Agilent recognizes that customers require data protection for their PC workstations and computer controlled manufacturing equipment such as the 5DX Test System and associated workstations.

应用说明 2004-08-26

The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

应用说明 2004-08-20

PDF PDF 260 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

应用说明 2004-08-08

PDF PDF 102 KB
High-Precision TDR with the Agilent 86100 DCA & Picosecond Pulse Labs 4020 Source Enhancement Module
Learn how to build a high-precision time-domain reflectometry/time-domain transmission measurement system.

应用说明 2003-09-12

PDF PDF 288 KB
Test Coverage: What Does It Mean when a Board Test Passes?
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.

应用说明 2003-07-28

PDF PDF 266 KB
Discharge on Unpowered Agilent 3070 Systems
This paper is applicable to both powered and unpowered Agilent 3070 systems, but does not explain how a discharge routine is created on an Unpowered system.

应用说明 2003-06-13

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