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High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.

Application Note 2008-04-30

PDF PDF 67 KB
The Future of In-Circuit Testing in the High-speed, Complex Electronics Environment
As board complexity and node counts continue to rise and high speed differential signaling continues to grow in popularity, In-Circuit Test needs to move quickly beyond the traditional realms. This article explores this in detail.

Application Note 2007-10-31

PDF PDF 176 KB
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Making the Most of Agilent Throughput Multiplier on Medalist In-Circuit Test Systems
Agilent Throughput Multiplier reduces test time on in-circuit test systems by testing up to four boards of a single-board-type panel simultaneously. The tips in this application note will help users make the most of this valuable tool.

Application Note 2007-10-12

Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

Application Note 2007-04-17

PDF PDF 227 KB
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“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

Application Note 2006-02-07

PDF PDF 44 KB
In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

Application Note 2005-05-25

PDF PDF 172 KB
Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

Application Note 2005-02-22

PDF PDF 421 KB
The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

Application Note 2004-08-20

PDF PDF 260 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

Application Note 2004-08-08

PDF PDF 102 KB
Test Coverage: What Does It Mean when a Board Test Passes?
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.

Application Note 2003-07-28

PDF PDF 266 KB
Testing Transformers on Unpowered Systems
This paper explains how to test basic analog parts, using unpowered systems.

Application Note 2003-03-21

PDF PDF 10 KB
Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.

Application Note 2003-03-01

PDF PDF 242 KB
Using Boundary Scan to Link Design and Manufacturing Test
By leveraging boundary-scan tests generated in Design and re-using them at Manufacturing Test, manufacturers can produce long-term benefits in terms of lower costs, greater efficiencies and higher quality products.

Application Note 2003-03-01

PDF PDF 502 KB
What to Consider When Selecting the Optimal Test Strategy
This paper addresses several issues for selecting the optimal inspection strategy, presenting data from many studies that Agilent has performed in the quest to find the optimal test / inspection strategy.

Application Note 2003-03-01

PDF PDF 175 KB
Design for Testability - Test for Designability
This paper addresses testability considerations, both physical and logical, and focuses on both the new constraints and the new freedoms of modern manufacturing test in the ever-changing challenge.

Application Note 2003-01-28

PDF PDF 852 KB
System Issues in Boundary-Scan Board Test
While Boundary-Scan is a powerful test tool, test engineers are finding out that yesterday's DFT rules and test approaches may actually be detrimental to successfully testing systems on a board.

Application Note 2003-01-28

PDF PDF 37 KB
Ground Bounce Basics and Best Practices
This article offers a description of the physical properties that result in ground bounce during board test.

Application Note 2003-01-28

PDF PDF 138 KB
A New Process for Measuring and Displaying Board Test Coverage
Written by Kenneth P. Parker, Agilent Technologies. First presented at Apex 2003, Anaheim, California.

Application Note 2003-01-01

PDF PDF 116 KB
UNIX vs. Windows Differences for 3070 Users
This documentation serves as a PC transition guide to help existing 3070 customers migrate from the Unix platform to the PC platform.

Application Note 2002-09-19

Windows & Unix Feature Comparison
The Windows & Unix 3070 Feature Comparison document provides a detailed listing of features translated to the Windows based 3070 from the Unix based 3070.

Application Note 2002-07-31

PDF PDF 71 KB
3070 In System Programming (ISP) Family
On Board Programming, Bottom Line Benefits

Application Note 2002-07-25

PDF PDF 200 KB
Maintaining Power with Dual Stage Fixtures
Occasionally there is a need to do dual stage fixturing where power must be maintained during parts of both stages.

Application Note 2002-06-07

PDF PDF 48 KB
PLD Programming on the Agilent 3070 Using the PLD ISP Product
In-System Programmable PLDs are more widely used on today's boards to provide flexibility to design engineers and to reduce the cost of a product.

Application Note 2002-02-26

PDF PDF 242 KB
3070 Series 3 Flash70 Programming Guide
This guide contains information about the procedures, tasks, and syntax required to perform flash programming with HP 3070 test systems.

Application Note 2001-09-12

PDF PDF 1.85 MB
Breakthrough Innovations: Agilent Automated Silicon Nails
Automated Silicon Nails takes the popular IEEE 1149.1 Boundary-Scan standard even further by using Boundary-Scan chains to automatically test non-Boundary-Scan devices.

Application Note 2001-08-15

PDF PDF 460 KB

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