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How to build a fixture for use with the Agilent Cover-Extend Technology
Cover-Extend Technology is Agilent’s latest limited access solution for in-circuit test. This paper documents the necessary information for a fixture vendor to build a Cover-Extend fixture.

어플리케이션 노트 2011-06-24

PDF PDF 1.09 MB
Power Supply Connections for Your CET Signal Conditioner Card Application Note
The Cover-Extend Technology signal conditioner card can be powered from various sources. The recommended sources are discussed in this application note.

어플리케이션 노트 2011-06-23

PDF PDF 150 KB
TestJet & VTEP hardware description and verification
This application note describes the TestJet and VTEP hardware components and the required connections for assembly on test fixtures. It also provides instructions for the setup and use of the Fixture Verifier.

어플리케이션 노트 2010-12-22

PDF PDF 2.17 MB
An Outlier Detection Based Approach for PCB Testing
This paper discusses enhancements to the capacitative leadframe testing technique, more commonly known as the Agilent patented VTEP technology. Reprinted with permission from IEEE.

어플리케이션 노트 2010-01-06

PDF PDF 1004 KB
Testing Bridges to Nowhere-Combining Boundary Scan and Capacitive Sensing
This paper describes existing limitations of the 1149.1 boundary scan techniques, IC design changes that would address these limitations and some experimental results. Reprinted with permission from IEEE.

어플리케이션 노트 2010-01-06

PDF PDF 455 KB
Network Parameter Measurement: Best Practices using the Agilent Medalist i3070
This paper describes how to maximize benefits from the Network Parameter Measurement capability on the Agilent Medalist i3070 in-circuit test system using enhancements in software version 7.20p.

어플리케이션 노트 2009-04-02

PDF PDF 55 KB
Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

어플리케이션 노트 2007-04-17

PDF PDF 227 KB
언어 
Implementation of Solder-bead Probing in High Volume Manufacturing
Copyright © 2006 IEEE. This material is posted here with permission of the IEEE. Reprinted from ITC International Test Conference, Paper 5.4.

어플리케이션 노트 2006-10-25

PDF PDF 844 KB
Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards
Bead probes were used to obtain additional test access on a high-density production printed circuit board. This case study includes practical information and key bead-specific learnings discovered during the process of outsourcing.

어플리케이션 노트 2006-10-24

PDF PDF 723 KB
언어 
Bead Probes In Practice
Copyright © 2005 IEEE. This material is posted here with permission of the IEEE. Reprinted from ITC International Test Conference, Paper 26.2.

어플리케이션 노트 2006-10-24

PDF PDF 2.20 MB