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Introduction to EMI/EMC Challenges and Their Solution
Agilent EEsof EDA presentation on how to, "Overcome High Speed Digital Design Challenges".

Seminar Materials 2012-02-16

PDF PDF 3.46 MB
Overcome PI Challenges on Perforated Power/Groung Planes
This presentation explains a different approach that's applicable to PI analysis on cost reduced consumer boards whose power/ground planes are perforated with signal traces.

Seminar Materials 2012-01-19

PDF PDF 2.30 MB
Overcome Signal Integrity Challenges in the multigigabit(s) Era
When digital signals reach gigabit/s speeds, the unpredictable becomes the norm. The process of getting your project back on track starts with the best tools for the job.

Seminar Materials 2011-12-15

PDF PDF 781 KB
Design and Test Challenges in Next Generation High-Speed Serial Standards
Attend this FREE education workshop at DesignCon 2012, brought to you by Agilent Technologies, Official Host Sponsor of the conference.

Training Materials 2011-11-29

View the recorded webcast - Be ready for the next generation HDMI standard
Be ready for the next generation HDMI standard

Training Materials 2011-11-08

View the recorded webcast - How to handle USB 3.0 physical layer test requirements
How to handle USB 3.0 physical layer test requirements.

Training Materials 2011-11-08

Overcoming Return-Path-Discontinuity in DDR3 and GDDR5 Memory-Controller Packages
A day in the life of a Memory Architect.

Seminar Materials 2011-10-24

PDF PDF 1.86 MB
Successful High Speed Digital Design with ADS, EMPro, and SystemVue
The materials in this self-guided workshop will show you the latest high speed digital capabilites in ADS 2011.

Seminar Materials 2011-09-29

Signal Integrity Design Using Channel Simulation and EM Co-design
The materials in this self-guided workshop will show you the “what if” design space exploration workflow that our new statistical eye diagram channel simulator enables

Seminar Materials 2010-04-21

Tips to Debugging DDR 1, 2 and 3 Physical and Protocol Layer Issues webcast

Training Materials 2009-01-06

ADMF: Facing the challenges of Super speed USB 3.0 Product Development
Agilent Digital Measurement Forum (ADMF): Facing the challenges of Super speed USB Product Development

Seminar Materials 2008-11-12

PDF PDF 1.78 MB
Hacking the Backplane:Complete Differential Channel Characterization & Analysis from 4-port Meas.

Seminar Materials 2008-11-09

How to Solve DDR Signal Integrity Validation Challenges
How to Solve DDR Signal Integrity Validation Challenges

Training Materials 2008-02-13

Why Do Measurement-based Channel Modeling?
Adobe .pdf of the paper presented at the High-Speed Digital Seminar, Ensuring MultiGigabit Design Success

Seminar Materials 2008-01-20

PDF PDF 3.62 MB
Minimizing Crosstalk in Hi-Speed Interconnects using Measurement-based Modeling
This Presentation presented by Mike Resso (Agilent Technologies) focuses on minimizing crosstalk in high speed interconnects using measurement-based modeling.

Seminar Materials 2006-09-01

PDF PDF 1.50 MB
Testing Receiver Jitter Tolerance eSeminar FAQs
Testing Receiver Jitter Tolerance eSeminar FAQs

Seminar Materials 2006-06-14

PDF PDF 50 KB
Jitter Measurements for High-Speed Digital
Jitter Measurements for High-Speed Digital Transmission

Seminar Materials 2006-06-14

PDF PDF 44 KB
Jitter in Digital Circuits eSeminar FAQs
FAQs from the eSeminar

Seminar Materials 2006-05-11

PDF PDF 34 KB
TDR vs. VNA Interconnect Characterization eSeminar FAQs
FAQs from the eSeminar

Seminar Materials 2006-05-11

PDF PDF 18 KB
Analyzing Digital Jitter and its Component eSeminar FAQs
FAQs from the eSeminar

Seminar Materials 2006-05-11

PDF PDF 35 KB
Solving Real World Jitter Problems for High-Speed Communications eSeminar FAQs
FAQs from the eSeminar

Seminar Materials 2006-05-11

PDF PDF 53 KB
Characterization and Modeling of a High Speed Backplane Differential Channels eSeminar FAQs
FAQs from the eSeminar

Seminar Materials 2006-05-11

PDF PDF 80 KB
Jitter Analysis: What Works, What Doesn't & Why eSeminar FAQs
FAQs from the eSeminar

Seminar Materials 2006-05-11

PDF PDF 63 KB
Jitter Measurements with a High-Speed Scope eSeminar FAQs
FAQs from the eSeminar

Seminar Materials 2006-05-11

PDF PDF 117 KB
Signal Integrity eSeminar Series Q&A: Being Successful with Fully Buffered DIMM (FBD) Designs
The following Questions and Answers were created from the live eSeminar broadcast of January 25, 2005. You can view the archived eSeminar by going to

Seminar Materials 2005-01-25

PDF PDF 60 KB

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