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Fault Detective Case Study #1 Presentation
4 slide presentation that summarizes Agilent employing its test optimization software to improve the quality and yield of its RF printed circuit assemblies.
案例研究 2005-09-26 |
PDF
72 KB
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Be generous with tests (Slösa med testerna)
Written by Stig Oresjo, Agilent Technologies. This article discusses the use of AOI for success in lead-free since the lead-free process is less forgiving, than tin-lead. Note that the article is in Swedish.
專文 2005-08-31 |
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用於氣候模擬箱 (climatic chamber) 的自動測試 VEE Pro
ISSeP (比利時) 使用 VEE Pro 開發出自動系統，以分析氣候模擬箱、培養箱和冷凍裝置的特性。
案例研究 2005-05-09 |
PDF
238 KB
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用於材料特性分析的 VEE Pro
ONERA (法國) 使用寫入 VEE Pro 中的自動測試設定，分析太空國防材料的 EM 吸收與反射特性。
案例研究 2005-05-09 |
PDF
591 KB
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End of Support Letters
Good business decisions start with good information, which is why we communicate with customers twice a year about our latest Support Life Policies.
專題報導 2005-04-18 |
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Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Agilent Medalist Family of test and inspection systems.
案例研究 2005-03-14 |
WMF
19.21 MB
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AXI Conquers Hidden Joint Defects
Written by Jeremy Jessen, Agilent Technologies. Published In SMT magazine, February 2005.
專文 2005-02-01 |
PDF
134 KB
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Traceable Calibration for 3070
As test equipment ages, system performance degrades. Agilent can help protect your investment with NIST traceable system calibration.
專題報導 2004-12-13 |
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Using AOI to Verify IPC Compliance
Written by Malachy Rice, Ph.D, Agilent Technologies. Appeared in Machine Vision supplement of Test & Measurement World, November 2004.
專文 2004-11-01 |
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Solid Shape Modeling - Working Towards 3-D AOI
Written by Xuemei Zhang and Gareth Bradshaw, Agilent Technologies. Published in Surface Mount Technology magazine, November 2004.
專文 2004-11-01 |
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Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.
專文 2004-10-01 |
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3D Techniques in SMT Test
By Malachy Rice, Ph.D, Stacy Johnson and Glen Leinbach, Agilent Technologies. Published by EE - Evaluation Engineering, February 2004.
專文 2004-09-28 |
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Utilizing VEE for Data Collection in Surface and Undersea Research
Utilizing VEE for Data Collection in Surface and Undersea Research
案例研究 2004-05-27 |
PDF
130 KB
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Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").
案例研究 2004-05-26 |
PDF
53 KB
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Vectorless Test EP (VTEP) Goes Head-to-Head with Agilent TestJet
In beta tests, VTEP proved its abilities to improve in-circuit test coverage by over 80 percent compared to Agilent TestJet, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.
案例研究 2003-12-16 |
PDF
351 KB
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Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Agilent to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.
案例研究 2003-10-24 |
PDF
600 KB
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Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.
專文 2003-10-01 |
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Agilent Quality Tool Testimonials
Learn what users have to say about Agilent Quality Tool.
案例研究 2003-09-30 |
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ScanWorks Reduces Vivace Networks' ICT Costs and Improves Board Quality
This paper discusses how Vivace Networks uses ScanWorks at the benchtop and at in-circuit test to reduce test costs and accelerate time to market in a competitive environment.
案例研究 2003-07-31 |
PDF
29 KB
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Lucent Demonstrates how ScanWorks for the Agilent 3070 Can Save Nearly $1 Million Per Year
Lucent has demonstrated that reusing ScanWorks boundary-scan tests on the 3070 ICT platform can produce dramatic cost savings through lower test development and fixture costs without giving up test coverage.
案例研究 2003-07-23 |
PDF
222 KB
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Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.
專文 2003-07-01 |
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3D Inline SPI
PCB PULSE ARTICLE: Solder paste printing can account for up to 80 percent of all board defects. A new article by Stacy Kalisz Johnson describes how the Agilent SP50 hits that big target at two assembly houses that test fine pitch devices.
專題報導 2003-06-20 |
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Motorola Drives Reliability and Productivity of In-Car Safety Systems with the Agilent 3070
To maintain rigorous testing without hindering assembly line productivity, Motorola chose the Agilent 3070 In-circuit Test System.
案例研究 2003-06-03 |
PDF
2.01 MB
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ScanWorks Completes Successful Assessment at Jabil Circuit
One of the first places electronics manufacturers look to reduce expenses is through the elimination of redundant effort.
案例研究 2003-03-21 |
PDF
661 KB
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AwareTest xi Case Study #1
This case study compares a fully-probed in-circuit test on a conventional high node count test system with a combined x-ray/in-circuit test strategy, using the simplified in-circuit test.
案例研究 2003-02-15 |
PDF
127 KB
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