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Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.

專文 2005-12-05

PDF PDF 57 KB
Overcoming Lower Wetting Forces of Lead-Free Alloys
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, March 2005.

專文 2005-12-05

PDF PDF 77 KB
Fault Detective Case Study #1 Presentation
4 slide presentation that summarizes Agilent employing its test optimization software to improve the quality and yield of its RF printed circuit assemblies.

案例研究 2005-09-26

PDF PDF 72 KB
Be generous with tests (Slösa med testerna)
Written by Stig Oresjo, Agilent Technologies. This article discusses the use of AOI for success in lead-free since the lead-free process is less forgiving, than tin-lead. Note that the article is in Swedish.

專文 2005-08-31

用於材料特性分析的 VEE Pro
ONERA (法國) 使用寫入 VEE Pro 中的自動測試設定,分析太空國防材料的 EM 吸收與反射特性。

案例研究 2005-05-09

PDF PDF 591 KB
用於氣候模擬箱 (climatic chamber) 的自動測試 VEE Pro
ISSeP (比利時) 使用 VEE Pro 開發出自動系統,以分析氣候模擬箱、培養箱和冷凍裝置的特性。

案例研究 2005-05-09

PDF PDF 238 KB
End of Support Letters
Good business decisions start with good information, which is why we communicate with customers twice a year about our latest Support Life Policies.

專題報導 2005-04-18

Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Agilent Medalist Family of test and inspection systems.

案例研究 2005-03-14

WMF WMF 19.21 MB
AXI Conquers Hidden Joint Defects
Written by Jeremy Jessen, Agilent Technologies. Published In SMT magazine, February 2005.

專文 2005-02-01

PDF PDF 134 KB
Traceable Calibration for 3070
As test equipment ages, system performance degrades. Agilent can help protect your investment with NIST traceable system calibration.

專題報導 2004-12-13

Solid Shape Modeling - Working Towards 3-D AOI
Written by Xuemei Zhang and Gareth Bradshaw, Agilent Technologies. Published in Surface Mount Technology magazine, November 2004.

專文 2004-11-01

Using AOI to Verify IPC Compliance
Written by Malachy Rice, Ph.D, Agilent Technologies. Appeared in Machine Vision supplement of Test & Measurement World, November 2004.

專文 2004-11-01

Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

專文 2004-10-01

3D Techniques in SMT Test
By Malachy Rice, Ph.D, Stacy Johnson and Glen Leinbach, Agilent Technologies. Published by EE - Evaluation Engineering, February 2004.

專文 2004-09-28

Utilizing VEE for Data Collection in Surface and Undersea Research
Utilizing VEE for Data Collection in Surface and Undersea Research

案例研究 2004-05-27

PDF PDF 130 KB
Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

案例研究 2004-05-26

PDF PDF 53 KB
Vectorless Test EP (VTEP) Goes Head-to-Head with Agilent TestJet
In beta tests, VTEP proved its abilities to improve in-circuit test coverage by over 80 percent compared to Agilent TestJet, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.

案例研究 2003-12-16

PDF PDF 351 KB
Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Agilent to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

案例研究 2003-10-24

PDF PDF 600 KB
Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.

專文 2003-10-01

Agilent Quality Tool Testimonials
Learn what users have to say about Agilent Quality Tool.

案例研究 2003-09-30

ScanWorks Reduces Vivace Networks' ICT Costs and Improves Board Quality
This paper discusses how Vivace Networks uses ScanWorks at the benchtop and at in-circuit test to reduce test costs and accelerate time to market in a competitive environment.

案例研究 2003-07-31

PDF PDF 29 KB
Lucent Demonstrates how ScanWorks for the Agilent 3070 Can Save Nearly $1 Million Per Year
Lucent has demonstrated that reusing ScanWorks boundary-scan tests on the 3070 ICT platform can produce dramatic cost savings through lower test development and fixture costs without giving up test coverage.

案例研究 2003-07-23

PDF PDF 222 KB
Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.

專文 2003-07-01

3D Inline SPI
PCB PULSE ARTICLE: Solder paste printing can account for up to 80 percent of all board defects. A new article by Stacy Kalisz Johnson describes how the Agilent SP50 hits that big target at two assembly houses that test fine pitch devices.

專題報導 2003-06-20

Motorola Drives Reliability and Productivity of In-Car Safety Systems with the Agilent 3070
To maintain rigorous testing without hindering assembly line productivity, Motorola chose the Agilent 3070 In-circuit Test System.

案例研究 2003-06-03

PDF PDF 2.01 MB

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