技术支持
去除所有优化1-25 / 69
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How to build a fixture for use with the Agilent Cover-Extend Technology
Cover-Extend Technology is Agilent’s latest limited access solution for in-circuit test. This paper documents the necessary information for a fixture vendor to build a Cover-Extend fixture.
应用说明 2011-06-24 |
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1.09 MB
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Medalist i3070 In Circuit Test – Utilizing the most comprehensive Limited Access
This article introduces the seven most prominent and effective limited access tools on the Agilent Medalist i3070 ICT, collectively known Super 7 suite.
应用说明 2009-03-06 |
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342 KB
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High Node Count Fixturing Solutions for Agilent Short-Wire Test Fixtures
This paper discusses problems encountered in building large, high node count vacuum actuated test fixtures for the Agilent 3070 family of board test systems.
应用说明 2008-04-30 |
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67 KB
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Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.
应用说明 2007-04-17 |
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Life and Stability of the Agilent 5DX Sealed X-ray Tube
Agilent has developed a sealed ultra-high vacuum X-ray tube that provides stable output throughout a significantly long life.
应用说明 2007-01-22 |
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78 KB
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Considerations for Surface Map Setup
The concept of delta-Zs is perhaps the most difficult thing to understand about the surface map process.
应用说明 2006-08-08 |
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AOI - A Strategy for Closing the Loop
This paper describes a set of defect prevention solutions centered on the availability of high-quality inspection and measurements data from an AOI system and a few carefully engineered software applications
应用说明 2006-04-16 |
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291 KB
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“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test
应用说明 2006-02-07 |
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44 KB
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In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.
应用说明 2005-05-25 |
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172 KB
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Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.
应用说明 2005-02-22 |
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421 KB
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Instructions for Using One Confirmation and Adjustment Panel with Multiple Systems
Readjusting the thickness table setting for one machine, using the Confirmation and Adjustment Panel, and adjustment data for a second machine, improves the portability of applications between the two machines.
应用说明 2004-08-26 |
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The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.
应用说明 2004-08-20 |
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260 KB
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Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.
应用说明 2004-08-08 |
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102 KB
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Solder Paste Inspection - Organize the Pieces
Published in Global SMT & Packaging, November 2003
应用说明 2003-11-01 |
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818 KB
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High Precision Time Domain Reflectometry (AN 1304-7)
Techniques for achieving the highest possible accuracy and resolution in signal integrity impedance measurements
应用说明 2003-10-27 |
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3.72 MB
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High-Precision TDR with the Agilent 86100 DCA & Picosecond Pulse Labs 4020 Source Enhancement Module
Learn how to build a high-precision time-domain reflectometry/time-domain transmission measurement system.
应用说明 2003-09-12 |
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288 KB
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Realizing the Benefits of 3D Inline Solder Paste Inspection
Published in SMT Magazine/Germany, August 2003
应用说明 2003-08-01 |
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67 KB
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Test Coverage: What Does It Mean when a Board Test Passes?
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.
应用说明 2003-07-28 |
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266 KB
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3D Inline Solder Paste Inspection - Benefit Realized
100% solder paste inspection helps to reduce the contribution from the print process to solder joint defects.
应用说明 2003-06-01 |
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59 KB
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Solder Paste Inspection for the SMT line: 3D In-line Systems Come of Age
Published in Electronic Production & Test, May 2003.
应用说明 2003-05-01 |
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115 KB
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Testing Transformers on Unpowered Systems
This paper explains how to test basic analog parts, using unpowered systems.
应用说明 2003-03-21 |
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10 KB
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Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.
应用说明 2003-03-01 |
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242 KB
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PLR and 5DX Customized Defect Names Implementation
You can use customized defect names on both the 5DX and on the PLR. This is particularly valuable when you want to display defect names in a local language.
应用说明 2003-03-01 |
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What to Consider When Selecting the Optimal Test Strategy
This paper addresses several issues for selecting the optimal inspection strategy, presenting data from many studies that Agilent has performed in the quest to find the optimal test / inspection strategy.
应用说明 2003-03-01 |
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175 KB
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Using Boundary Scan to Link Design and Manufacturing Test
By leveraging boundary-scan tests generated in Design and re-using them at Manufacturing Test, manufacturers can produce long-term benefits in terms of lower costs, greater efficiencies and higher quality products.
应用说明 2003-03-01 |
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502 KB
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