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Agilent Ships Newest SPICE Model Extraction and Qualification Software
Agilent announces shipment of the latest release of its industry-leading SPICE model extraction tool, Model Builder Program, and SPICE qualification tool, Model Quality Assurance.

プレス資料 2013-03-13

Agilent Technologies Launches Recognition Program for EDA Experts
Agilent launches its Agilent Certified Expert recognition program for EDA experts. Eligible participants include individuals demonstrating a high level of expertise-both theoretical and practical-in applying Agilent EEsof EDA tools for product design and modeling.

プレス資料 2013-03-12

Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
Agilent announces the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).

プレス資料 2012-12-18

MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
Experts Share Insight on Compact Device Modeling with Emphasis on Simulation-Aware Models.

プレス資料 2012-12-12

Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.

プレス資料 2012-08-23

Agilent Extends Partnership with AMCAD to Include Nonlinear Modeling and Measurement Services
Agilent announces that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.

プレス資料 2012-06-19

Agilent to Demonstrate Its Newest RF/Microwave Design and Test Products at IMS
Agilent will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2012 IEEE MTT-S International Microwave Symposium (Booth 1015), June 17-22, at the Palais des congrès de Montréal.

プレス資料 2012-06-04

Agilent Announces Shipment of the IC-CAP 2012 Platform for Device Characterization and Modeling
Agilent announces shipment of the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP) for 2012.

プレス資料 2012-03-02

Agilent Completes Acquisition of Accelicon Technologies’ Solutions for Semiconductor Device Modeling
Agilent Technologies announced that Accelicon Technologies’ software solutions and technology for device-level modeling and validation in the electronics industry are now part of Agilent.

プレス資料 2012-02-21

Agilent Technologies Ships Latest IC-CAP Platform for DC and RF Device Characterization and Modeling
Software improves modeling flow with link between measurement and extraction

プレス資料 2011-05-10

Agilent Introduces IC-CAP WaferPro Software for Automating Complex Device Modeling Applications
IC-CAP WaferPro provides a multi-site, multi-wafer, automated DC and RF measurement solution for semiconductor device modeling applications.

プレス資料 2010-08-19

Agilent Software Enables Successful Development of Hua Hong NEC's RF Device Modeling Platform

プレス資料 2010-06-11

Agilent Technologies Announces YouTube Channel for Agilent EEsof EDA
Channel Features More than 100 Videos with Subtitles in 50 Languages.

プレス資料 2010-01-19

ACCO Semiconductor chooses Agilent RFIC Solutions Software for Next-Generation CMOS Power Amplifier
GoldenGate is the most trusted simulation, verification and analysis solution available for integrated RF circuit design within the Cadence Virtuoso design flow.

プレス資料 2010-01-11

Agilent's ADS for RF and Microwave High-Power Device Models Receives AMCAD Engineering Endorsement

プレス資料 2009-06-24

Agilent Announces Industry's First HiSIM2.4 Model Extraction Package for DC, RF Parameters
New IC-CAP Software Package Offers Improved CMOS Modeling Efficiency, Accuracy

プレス資料 2008-07-14