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Evolving Packages Drive Test and Inspection
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, March 2007

Article 2007-08-11

PDF PDF 747 KB
Medalist 3070 and Medalist i5000 System Recovery using Retrospect Express
This app note describes how to perform backups of the system hard disk for the Agilent Medalist 3070 and Agilent Medalist i5000 In-circuit Test systems that have been shipped with Retrospect Express 7.0 and Roxio Digital Media Plus 7.2 software.

Application Note 2007-07-10

PDF PDF 628 KB
Maximising Test Coverage with Agilent Medalist VTEP v2.0
This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

Application Note 2007-04-17

PDF PDF 227 KB
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Agilent Medalist i3070 07.00p Software Release
The Agilent Medalist i3070 In-circuit test 07.00p software adds new test throughput enhancements in test development and debug as well as in test execution. .

Release Notes 2007-02-21

PDF PDF 93 KB
Medalist i3070 In-Circuit Test System
Product Specification for the Agilent Medalist i3070 is the next generation In-Circuit Test System (ICT).

Data Sheet 2007-01-23

PDF PDF 444 KB
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Medalist i3070 In-Circuit Test Platform
Agilent Medalist i3070 is the next generation In-Circuit Test System (ICT) that provides significant return of investment with unparalleled test coverage and robustness.

Brochure 2007-01-10

PDF PDF 1.18 MB
In-circuit Testing of Low Voltage Devices
Core technical document summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

Application Note 2005-05-25

PDF PDF 172 KB
Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Agilent Medalist Family of test and inspection systems.

Case Study 2005-03-14

WMF WMF 19.21 MB
Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

Application Note 2005-02-22

PDF PDF 421 KB
Traceable Calibration for 3070
As test equipment ages, system performance degrades. Agilent can help protect your investment with NIST traceable system calibration.

Feature Story 2004-12-13

VTEP ROI Analysis
Discover how VTEP compares to existing technologies that are already in use worldwide.

Application Note 2004-10-04

VTEP Coverage Analysis
How much additional coverage can you really get with VTEP? The VTEP Coverage Analysis Tool provides a realistic estimate.

Application Note 2004-10-04

Safeguard and Low Voltage
Documents summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.

Application Note 2004-08-30

The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

Application Note 2004-08-20

PDF PDF 260 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

Application Note 2004-08-08

PDF PDF 102 KB
Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

Case Study 2004-05-26

PDF PDF 53 KB
Vectorless Test EP (VTEP) Goes Head-to-Head with Agilent TestJet
In beta tests, VTEP proved its abilities to improve in-circuit test coverage by over 80 percent compared to Agilent TestJet, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.

Case Study 2003-12-16

PDF PDF 351 KB
3070 05.31: PDU/POD Upgrade
Describes how to install the E1135C PDU and Pod upgrade.

Installation Manual 2003-12-01

PDF PDF 670 KB
Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Agilent to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

Case Study 2003-10-24

PDF PDF 600 KB
Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.

Article 2003-10-01

3070 05.31: DUT Power Supply Installation
Describes how to install device-under-test power supplies in the 3070 system.

Installation Manual 2003-10-01

PDF PDF 4.53 MB
ScanWorks Reduces Vivace Networks' ICT Costs and Improves Board Quality
This paper discusses how Vivace Networks uses ScanWorks at the benchtop and at in-circuit test to reduce test costs and accelerate time to market in a competitive environment.

Case Study 2003-07-31

PDF PDF 29 KB
Test Coverage: What Does It Mean when a Board Test Passes?
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.

Application Note 2003-07-28

PDF PDF 266 KB
Lucent Demonstrates how ScanWorks for the Agilent 3070 Can Save Nearly $1 Million Per Year
Lucent has demonstrated that reusing ScanWorks boundary-scan tests on the 3070 ICT platform can produce dramatic cost savings through lower test development and fixture costs without giving up test coverage.

Case Study 2003-07-23

PDF PDF 222 KB
Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.

Article 2003-07-01

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