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Test & Measurement

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Get connected with new no-wire interface
PCB PULSE ARTICLE: The path between a tester and the device under test is crucial. That's why Agilent has committed three years and a team of eight engineers to develop new routing software for no-wire fixtures.

Feature Story 2004-03-12

Support Life Update
PCB PULSE ARTICLE: Many Agilent products have reached end of support (EOS). A complete summary is now available.

Feature Story 2004-02-05

New Software for the SJ Series
PCB PULSE ARTICLE: New software is on the way for the Agilent AOI/SPI systems, with key new algorithms and enhancements.

Feature Story 2004-02-05

VTEP: Next-Generation TestJet
PCB PULSE ARTICLE: TestJet used to be the industry standard for unpowered in-circuit test. A new case study shows that Agilent Vectorless Test EP is the new coverage leader.

Feature Story 2004-02-05

Motorola: Driven to Succeed
PCB PULSE ARTICLE: Motorola's Angers, France, facility provides boards for anti-lock brakes and regulated power steering systems. Failsafe reliability is not a goal but a mandate, which is why the company uses a 3070.

Feature Story 2003-10-16

Vectorless Test EP: the Next-generation TestJet
PCB PULSE ARTICLE: VTEP allows dramatic unpowered test coverage improvements on BGAs, saves potentially hours of test development time per board, and reduces fixture maintenance costs. And VTEP is included with release 05.30p.

Feature Story 2003-10-16

Fast, Accurate CAD Translation
PCB PULSE ARTICLE: CAMCAD works across Agilent AOI, ICT and X-ray systems, saving time and money while providing accurate CAD information down to the reference designator level.

Feature Story 2003-10-16

Cover Story: Global Reach, Local Access to Resources
PCB PULSE ARTICLE: Evolution is a good thing. Agilent's VP and General Manager of EMT Sales Marketing Support proves the point by describing how a revitalized Customer Team will allow Agilent to better serve customers in booming regions worldwide.

Feature Story 2003-10-16

New Software Improves Productivity, Lowers Costs
PCB PULSE ARTICLE: New system software for the Agilent 3070 includes important productivity capabilities plus 50 new features and enhancements.

Feature Story 2003-10-16

New Technical Support Content On Web
PCB PULSE ARTICLE: If you haven't visited the PCB Test and Inspection website recently, you're missing out on a wealth of new technical support content for Agilent 3070, 5DX and AOI systems.

Feature Story 2003-10-16

You're invited: Power of Imaging Web Seminar Series
PCB PULSE ARTICLE: PCB manufacturing gets more challenging each year. A new three-part webinar discusses the complexities, the impact on quality, and ways to cope using test strategy and process controls.

Feature Story 2003-10-16

Lucent Saves Time, Money With ScanWorks
PCB PULSE ARTICLE: Lucent Technologies evaluated ASSET InterTech's ScanWorks software and discovered nearly a million reasons to re-use boundary-scan tests on the Agilent 3070.

Feature Story 2003-10-16

Third-party Support for EFS
PCB PULSE ARTICLE: Integrated Production and Test Engineering (IPTE), an Agilent Channel Partner, has recently begun providing support services for EFS board handlers, and is working with Agilent to ensure uninterrupted support.

Feature Story 2003-10-16

Release 4.08: Faster, Better AOI
PCB PULSE ARTICLE: System software 4.08 introduces powerful new features to the Agilent SJ50, and the upgrade might be free to you.

Feature Story 2003-10-16

2D v. 3D, That is the Question
PCB PULSE ARTICLE: Most companies do some sort of 2D solder paste inspection (SPI), but a recent industry study shows that automated 3D inspection is preferred, in some cases required, in four out of five cases industry-wide.

Feature Story 2003-10-16

European User Group Meeting
PCB PULSE ARTICLE: The 4th annual Agilent European Users Group Meeting was held across Europe in October with more than 70 customers present.

Feature Story 2003-10-16

WLAN promises mobility in this fast-paced world
The residential market is the fastest growing segment of the wireless LAN business.

Feature Story 2003-09-01

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VTEP: Success on the road
PCB PULSE ARTICLE: Recent roadshows and tradeshows have been perfect forums for VTEP, the new vectorless test technology that improves test coverage over the original TestJet.

Feature Story 2003-08-18

AXI versus AOI: When, Where, Why
PCB PULSE ARTICLE: When should you use AOI, when should you use AXI, and when should you use both? There's no universal answer, but a new paper by Agilent Senior Test Strategy Consultant Stig Oresjo explores some of the guiding principles.

Feature Story 2003-06-20

NEMI Test Strategy Project Shows Results
PCB PULSE ARTICLE: The National Electronics Manufacturing Initiative (NEMI) Test Strategy project produced a new Test Strategy Cost Model and presented the results of a Test Coverage Analysis Study at APEX 2003.

Feature Story 2003-06-20

Jabil Cuts Costs by ~25% with ScanWorks
PCB PULSE ARTICLE: Jabil Circuit has proved that manufacturers can lower test costs by eliminating redundant test development efforts with ScanWorks boundary-scan software.

Feature Story 2003-06-20

Agilent Solutions Knowledge Base
PCB PULSE ARTICLE: If you have an Internet connection and support contract, then Agilent expertise is literally as close as your keyboard.

Feature Story 2003-06-20

3D Inline SPI
PCB PULSE ARTICLE: Solder paste printing can account for up to 80 percent of all board defects. A new article by Stacy Kalisz Johnson describes how the Agilent SP50 hits that big target at two assembly houses that test fine pitch devices.

Feature Story 2003-06-20

Vectorless Test: New and Improved
PCB PULSE ARTICLE: Vectorless test just got better. Vectorless Test EP delivers dramatic unpowered test coverage improvements for BGAs, micro-BGAs and SMT connectors, and fully automates the test debug process.

Feature Story 2003-06-20

One-on-One Tech Support via Web
PCB PULSE ARTICLE: Agilent's Remote Support WebEx Support Center gives you immediate live access to Agilent technical support experts, almost as though they were right there at your site.

Feature Story 2003-06-20

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