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Electronic Warfare Testing: Capture, Measurement and Emulation Webcast Slides
Slides from the February 21, 2013 webcast

Présentation de séminaire 2013-02-21

PDF PDF 1.48 MB
Electronics Manufacturing Test - Support Update - Adobe file - used at Ohio, 2011 ATUG meeting
Electronics Manufacturing Test - Support Update - Adobe file - used at Ohio, 2011 ATUG meeting

Présentation de séminaire 2011-06-01

PDF PDF 1.82 MB
EM Insight Series Episode #8:Solder/Wafer Bumps for Flip Chip, CPS, and WLP Applications
ADS parameterized 3D component design kit enables quick drawing of 3D components.

Présentation de séminaire 2009-03-30

PDF PDF 1.19 MB
EM Insights Series Episode #11: An Oscillator Design Flow with Integrated 3D EM
This episode shows how 3D EM integration improves the predictive design of VOCs. Simulation accuracy is increased by taking into account the interaction between resonator and board design.

Présentation de séminaire 2009-06-04

PDF PDF 466 KB
EM Insights Series Episode #1: QFN Package
An Agilent Technologies Presentation (EM Insights Series, Episode #1) decribes QFN Package in detail.

Présentation de séminaire 2009-03-27

PDF PDF 1.32 MB
EM Insights Series Episode #2: Single and Multiple Band Microstrip Planar Array Antenna
An Agilent Technologies Presentation (EM Insights Series, Episode #2) decribes single (C Band) and multiple band (C and X band) microstrip planar array antenna in detail.

Présentation de séminaire 2009-03-30

PDF PDF 1.06 MB
EM Insights Series Episode #3: Wireless Network Card Antenna Design
An Agilent Technologies Presentation (EM Insights Series, Episode #3) decribes wireless network card antenna design in detail.

Présentation de séminaire 2009-03-30

PDF PDF 677 KB
EM Insights Series Episode #4: Contactor Design in High Volume RF Test Fixtures
An Agilent Technologies Presentation (EM Insights Series, Episode #4) decribes contactor design in high volume RF test fixtures in detail.

Présentation de séminaire 2009-03-31

PDF PDF 670 KB
EM Insights Series Episode #5: BGA Package Simulation
An Agilent Technologies Presentation (EM Insights Series, Episode #5) describes BGA package simulation in detail.

Présentation de séminaire 2009-03-31

PDF PDF 620 KB
EM Insights Series Episode #6: High Speed Connector Modeling with EMPro
An Agilent Technologies Presentation (EM Insights Series Episode #6) decribes high speed connector modeling with EMPro in detail.

Présentation de séminaire 2009-03-24

PDF PDF 280 KB
EM Insights Series Episode #7: High Speed SATA Connector Modeling with EMPro
An Agilent Technologies Presentation (EM Insights Series Episode #7) decribes high speed SATA (Serial ATA) connector modeling with EMPro in detail.

Présentation de séminaire 2009-03-24

PDF PDF 750 KB
EM Insights Series Episode #8:Solder/Wafer Bumps for Flip Chip, CPS, and WLP Applications
ADS parameterized 3D component design kit enables quick drawing of 3D components.

Présentation de séminaire 2009-03-30

PDF PDF 1.19 MB
EM Insights Series Episode #9: Dielectric Bricks, Laminates, LTCC 3D Em Simulations
This episode discusses the advantages of using EMDS G2

Présentation de séminaire 2009-03-30

PDF PDF 1.68 MB
Embedded Debug Webast Slides
Slides from the Jan 25, 2009 webcast

Présentation de séminaire 2007-01-25

PDF PDF 3.22 MB
EMC Back to Basics Webcast Slides
Slides from the April 16, 2014 webcast

Présentation de séminaire 2014-04-16

PDF PDF 3.40 MB
EMPro Solving Challenges of 3D EM Designs
Overview of some of the powerful capabilities of Electromagnetic Professional (EMPro).

Présentation de séminaire 2009-08-04

PDF PDF 4.08 MB
EMPro Workshop
The materials in this in-depth hands-on workshop highlights the use of EMPro and ADS to create 3D geometries and analyze them with Finite Element Method (FEM) and Finite Difference Time Domain (FDTD) simulators.

Présentation de séminaire 2010-06-07

EMPro Workshop Presentation
Presentation for 3D Electromagnetic Hands-On Workshop using EMPro

Présentation de séminaire 2012-08-16

PDF PDF 9.13 MB
Enabling MIPI Physical Layer Test- High Speed and Characterization

Présentation de séminaire 2011-10-04

End-to-End Design and Simulation of Handset Modules
What goes into real-life PA design considerations? Dr. Peter Zampardi and Dr. Hongxiao Shao share Skyworks design methodology considering all components necessary for a handset power amplifier (PA) or Front-end Module (FEM) based on III-V HBT and BiFET technologies.

Présentation de séminaire 2012-02-27

PDF PDF 1.02 MB
Essentials of OFDM and MIMO Webcast Slides
Slides from the September 20, 2012 webcast

Présentation de séminaire 2012-09-20

PDF PDF 1.32 MB
Eye Diagram Measurements in Advanced Design System
It is a detailed Seminar on Eye Diagram Measurements in Advanced Design System. It also covers Frequency Domain Analysis of an Interconnect and Optimization of an Equalizer Performance.

Présentation de séminaire 2006-05-26

PDF PDF 1.78 MB
FAQ's from the Bead Probe Webcast

Présentation de séminaire 2004-02-10

XLS XLS 53 KB
Fast and Accurate Frequency Converter Webcast Slides
Slides from the Apr 19, 2012 Webcast presented by David Ballo.

Présentation de séminaire 2012-04-19

PDF PDF 2 MB
Fast Characterization of Power Amplifier Performance with Modulated Signals
Innovations in EDA Webcast Series: Part 3 of the RF Power Amplifier Design Series.

Présentation de séminaire 2012-04-05

PDF PDF 1.79 MB

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