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Boundary-Scan Advanced Diagnostic Methods
This paper illustrates how usage of boundary scan circuit information and predictive analysis of potential assembly faults will provide more precise and accurate diagnostic information.

專文 2012-04-17

PDF PDF 1.20 MB
Two-Stage Over-the-Air (OTA) Test Method for LTE MIMO Device Performance Evaluation
International Journal of Antennas and Propagation, February, 2012, article introduces a novel, flexible, and cost-effective method for measuring MIMO OTA using a two-stage approach.

專文 2012-03-28

Addressable Test Structures for MOSFET Variability Analysis
This IEEE paper presents a 4-bit addressable array-based test structure with a centre reference transistor allowing evaluation of variability in advanced technologies.

專文 2012-03-19

Tackling MIMO Design and Test Challenges for 802.11ac WLAN
This article from Microwave Journal shows how the system engineer can use system simulation to help understand the design performance and design requirements needed to achieve transmitter system-level metrics such as EVM.

專文 2012-03-11

EE Times Design article: Options for simulating wideband signals

專文 2012-02-23

Using Software Defined Instruments to Address the Mixed-Signal Test Challenges of Today’s Software
Link to a NASA Tech Brief article which states to ensure successful operation of SDR designs requires use of modern instruments capable of bridging the digital-analog divide, while also addressing any challenges stemming from use of the SDR technology itself

專文 2012-02-01

Electronic Manufacturing Test Support eNews - January 2012
Latest information to help you with ICT, 5DX and Automotive Electronics Functional Test Systems Support

新聞簡訊 2012-01-31

Practical Digital Wireless Signals
Learn the intricacies and tradeoffs in signal selection and design with this practical guide book from Earl McCune.

期刊 2011-12-06

Defining the 4G PHY Architecture Design Challenges
EE Times design article (Part 1) on defining the 4G PHY architecture design challenges.

期刊 2011-12-05

Using SystemVue to Overcome 4G Challenges
EE Times design article (Part 2) on using SystemVue to overcome 4G challenges.

期刊 2011-12-04

Article: Case study - Threat simulation for multi-port radar and electronic warfare systems
Case Study

案例研究 2011-11-30

High-Speed Data Throughput Test
Ensure a quality user experience by fully testing the packet data performance of your wireless device early in the design cycle. The 8960 offers the highest 2G/3G/3.5G data rates and real-world testing to find issues sooner and resolve them faster!

專題報導 2011-11-29

802.11ac Wireless LAN: what’s new and the impact on design and test
EE times article by Agilent’s Mirin Lew describing the 802.11ac, the technical challenges and comparisons to earlier technologies.

專文 2011-11-09

Microwaves & RF article: Enhancing Analysis Of Spurious Emissions
Enhancing analysis of spurious emissions shows that understanding the test instrument and measured signal can impact speed and accuracy.

專文 2011-11-07

In-Circuit Test (ICT): The King Is Dead; Long Live the King!
Reports of the demise of in-circuit testing have been exaggerated for at least 20 years. Despite this, ICT is still here and kicking. This paper discusses various reasons why the King lives on.

專文 2011-11-04

PDF PDF 67 KB
Surviving State Disruptions Caused by Test: A Case Study - Article Reprint
This paper discusses new instructions for IEEE 1149.1 boundary scan tests that can remove "lobotomy problems" during tests.

專文 2011-11-04

PDF PDF 338 KB
Defect Coverage of Boundary-Scan Tests - Article Reprint
This paper discusses the potential and challenges with some defects when using the "PCOLA/SOQ" metric model in boundary scan test coverage.

專文 2011-11-04

PDF PDF 245 KB
Test Coverage: What Does It Mean when a Board Test Passes? - Article Reprint
Defining board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage. This paper explores an alternative 'defect universe' to better depict test coverage.

專文 2011-10-27

PDF PDF 89 KB
A New Probing Technique for High-Speed/High-Density Printed Circuit Boards - Article Reprint
This paper discusses how in-circuit test access can be maintained, even on highly dense gigabit logic boards.

專文 2011-10-24

PDF PDF 341 KB
LTE-Advanced…Already?
Article reprint from OSP magazine detailing the additional changes LTE-Advanced brings to the Network already working to implement 3GPP LTE.

專文 2011-09-01

PDF PDF 695 KB
ICT Boundary Scan Development Steps - Article Reprint
This paper discusses how test point access and good data can make a big difference in the success of your boundary scan test. Best practises for boundary scan test development are also highlighted.

專文 2011-08-08

PDF PDF 411 KB
LED Measurement Options at ICT - Article Reprint
This paper reviews current methods and constraints of LED color testing methodologies.

專文 2011-08-08

PDF PDF 306 KB
Successful ICT Boundary Scan Implementation - Article Reprint
This paper details eight steps which can help you get the best possible boundary scan test coverage with your i3070 in-circuit tester.

專文 2011-08-08

PDF PDF 111 KB
A Primer on Test Options - Article Reprint
This paper discusses why ICT remains the best option for high-volume electronics manufacturing, with its flexibility to provide a myriad of test options to meet different manufacturing needs.

專文 2011-08-08

PDF PDF 269 KB
Ultra-wideband radar system design article in EE Times

專題報導 2011-07-27

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