Contact an Expert

Technical Support

Test & Measurement

Find by Product Model Number: Examples: 34401A, E4440A

301-325 of 471

Sort:
New Challenges for UE Developers with Voice Transport Over LTE Slides
Jan 24, 2012 Webcast Slides

Seminar Materials 2012-01-24

PDF PDF 1.38 MB
Next Generation 802.11ac WLAN MIMO Design & Test Challenges Webcast Slides
Slides from the May 10, 2012 webcast

Seminar Materials 2012-05-10

PDF PDF 1.56 MB
Next generation BERT Ensures Signal Integrity in High-speed Digital Designs Webcast Slides
Slides from the January 21, 2014 webcast

Seminar Materials 2014-01-21

PDF PDF 1.96 MB
NFC Forum
The Near Field Communication (NFC) Forum is a non-profit industry association that promotes the use of NFC short-range wireless interaction in consumer electronics, mobile devices and PCs.

Seminar Materials 2014-03-25

NFC Test Challenges for Mobile Device Developers Webcast Slides
Slides from the February 26, 2013 webcast

Seminar Materials 2013-02-26

PDF PDF 2.77 MB
Nonlinear Characterization and Modeling Through Pulsed IV/S-Parameters Webcast Slides
Slides from the March 27, 2012 Webcast

Seminar Materials 2012-03-27

PDF PDF 2.16 MB
Optimize UE Design for Greater Battery Run-Time Webcast Slides
Slides for the April 26, 2012 webcast

Seminar Materials 2012-04-26

PDF PDF 1.76 MB
Optimize Wireless Device Battery Run-time: Innovative Measurements for Greater Insights Slides
Slides from the August 22, 2012 webcast

Seminar Materials 2012-08-22

PDF PDF 1.12 MB
Optimized Test Solutions to Enable Low-Cost Optical Amplification

Seminar Materials 2002-12-02

Opto-Electronic Signal Integrity on Optical Fiber Chip-to-Chip Links
An Agilent EEsof "Innovations in EDA" presentation on High Frequency RF Effects in High Speed Digital

Seminar Materials 2011-04-07

PDF PDF 651 KB
Opto-Electronic Signal Integrity on Optical Fiber Chip-to-Chip Links (VPIphotonics Overview)
Overview presentation by VPIphotonics

Seminar Materials 2011-04-08

PDF PDF 1.87 MB
Oscilloscope Bandwidth Requirements for Emerging Serial Data Interfaces
Adobe file of the paper presented during the Spring 2008 tour

Seminar Materials 2008-03-25

PDF PDF 1.65 MB
Overcome LTE-A and 802.11ac Manufacturing Test Challenges with Agilent’s new EXM Webcast Slides
Slides from the March 26, 2014 webcast

Seminar Materials 2014-03-26

PDF PDF 1.79 MB
Overcome LTE-A UE Design Test Challenges with Agilent’s New UXM Webcast Slides
Slides from the February 13, 2014 webcast

Seminar Materials 2014-02-13

PDF PDF 3.80 MB
Overcome PI Challenges on Perforated Power/Groung Planes
This presentation explains a different approach that's applicable to PI analysis on cost reduced consumer boards whose power/ground planes are perforated with signal traces.

Seminar Materials 2012-01-19

PDF PDF 2.30 MB
Overcome Signal Integrity Challenges in the multigigabit(s) Era
When digital signals reach gigabit/s speeds, the unpredictable becomes the norm. The process of getting your project back on track starts with the best tools for the job.

Seminar Materials 2011-12-15

PDF PDF 781 KB
Overcoming Return-Path-Discontinuity in DDR3 and GDDR5 Memory-Controller Packages
A day in the life of a Memory Architect.

Seminar Materials 2011-10-24

PDF PDF 1.86 MB
Package and Bondwire Effects with FEM
These materials show how ADS is used to verify a MMIC Ku-band LNA inserted in a 3-mil x 3-mil QFN package and with bond wires using the integrated FEM simulator.

Seminar Materials 2010-08-11

Part 1: High-Frequency IC Design
This Presentation ( Part 1: High-Frequency IC Design ) by Gopal Raghavan describes full-wave EM simulation, Optimization techniques, accurate wideband EM simulation and Thermal and mechanical consideration.

Seminar Materials 2003-06-24

PDF PDF 1.34 MB
Part 2: High-Frequency IC Test
This Presentation ( Part 2: High-Frequency IC Test ) by Gopal Raghavan details frequency domain measurements for PMD ICs, valuable insight into both single-ended and differential devices.

Seminar Materials 2003-06-25

PDF PDF 1.84 MB
Partners
Partners

Seminar Materials 2010-02-01

PCB Material Property Measurements for EM Simulations
Agilent EEsof EDA and Advantest Corporation present the Analysis of Test Coupon Structures for the Extraction of High Frequency PCB Material Properties.

Seminar Materials 2013-07-01

PDF PDF 1.59 MB
Phase Noise Measurement Methods and Techniques Webcast Slides
Slides from the July 19, 2012 Webcast

Seminar Materials 2012-07-19

PDF PDF 1.10 MB
Philips/TU Delft Bondwires Model
Presentation from the Agilent Measurement Forum 2010 in Seoul, Korea.

Seminar Materials 2010-06-23

PDF PDF 1.67 MB
Polarization Mode Dispersion Tolerance Testing – View the recorded Webcast

Seminar Materials 2008-05-27

Previous ... 11 12 13 14 15 16 17 18 19 Next