Technical Support
Automated Optical Inspection [Discontinued]
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1-25 of 197
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Automated Optical Inspection (AOI) - SJ50 and SJ5000 Series [Discontinued]
Access information on Agilent’s Medalist SJ50, sj5000 AOI systems.
Product/Service 2011-11-25 |
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Agilent Medalist AOI 4.12.05.06 Software Patch
The Medalist AOI 4.12.05.06 software Patch contains changes to the AOI software which provide improve performance and stability.
Software Update 2011-04-21 |
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AOI Family User Maintenance Training
Gain an understanding of the hardware components that make up an AOI system. Learn to maintain and repair your Agilent AOI system.
Classroom Training |
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Agilent Medalist AOI 4.12.05.05 Software Patch
The Medalist AOI 4.12.05.05 software Patch contains changes to the AOI software which provide improve performance and stability.
Software Update 2010-11-29 |
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Learn about the latest i3070 ICT productivity tools from us, DeMille Research, and Derby Associates
Originally broadcast Aug 24, 2010
Webcast - recorded |
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Agilent Medalist AOI 4.12.05.04 Software Patch
The Medalist AOI 4.12.05.04 software Patch contains changes to the AOI software which provide improve performance and stability.
Software Update 2010-07-28 |
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Is the Agilent SJ50 AOI system lead-free ready today?
Yes, the SJ50 is lead-free ready.
FAQ 2010-05-19 |
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Is Agilent's solder paste inspection solution lead-free ready? Is there a special lead-free setup required?
There are no special setup or system needs.
FAQ 2010-05-19 |
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What is the main reason that SMT manufacturers would use solder paste inspection for lead-free paste?
The print process for lead free requires fine tuning such as cycle time modifications, reduction in the aperature-to-pad ratios, squeegee speed/pressure changes, etc.
FAQ 2010-05-19 |
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Agilent Medalist SPI 3.1.6.02 Software Patch
The Agilent SP50 3.1.6.02 software Patch demonstrates the continuous innovation and commitment to improvement in solder paste inspection by Agilent.
Software Patch 2010-05-10 |
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Agilent Medalist AOI 4.12.05.03 Software Patch
This software patch contains changes to the AOI software which provide stability improvements.
Software Patch 2010-04-29 |
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Solder Paste Inspection (SPI) - SP50 Series [Discontinued]
Access information on Agilent’s Medalist SP50 solder paste inspection systems.
Product/Service 2010-04-25 |
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Automated Optical Inspection [Discontinued]
Access information on Agilent’s Medalist SJ50, sj5000 AOI and SP50 solder paste inspection systems.
Product/Service 2010-04-25 |
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SJ50 Conveyor Parts Identification
This document details the various parts used on the conveyor system of your SJ50 Medalist AOI.
User Manual 2010-04-23 |
PDF
978 KB
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Agilent Medalist SPI 3.1.6.01 Software Patch Release
Software Patch 2009-10-02 |
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Agilent Medalist AOI 4.12.05.02 Software Patch Release
Software Patch 2009-10-01 |
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Agilent Medalist AOI 4.12.05.01 Software Release
Software Patch 2009-08-18 |
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Agilent Medalist AOI 4.12.05 Software Release
The Medalist AOI 4.12.05 software update contains a series of changes to the AOI software which improve the performance and stability of your system.
Software Patch 2009-04-02 |
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Agilent SP50 3.1.6 Software Patch
The Agilent SP50 3.1.6 software Patch release demonstrates the continued innovation and commitment to improvement in solder paste inspection by Agilent.
Software Patch 2009-03-20 |
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sj5000 [Discontinued]
The latest in AOI the sj5000 is a unique balance that provides customers with best in class capability, return on investment, and defect coverage.
Product/Service 2009-03-02 |
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SJ50 Series 3 XL [Discontinued]
Building large boards, this platform can handle boards up to 24x24” in size with capability to expand to handle even larger.
Product/Service 2009-03-02 |
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Solder Paste Inspection and Management: SP50 Series 3 [Discontinued]
The SP50 provides users with blazing throughput, excellent repeatability, and full volume, height, area, and registration measurements. The SP50 can handle boards up to 19.5x19.5” and has the advantage of the Agilent head swap technology.
Product/Service 2009-03-02 |
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SJ50 Series 2 [Discontinued]
With the head swap capability to convert from a component inspection system to a 3D paste inspection system, this is an ideal solution for users who are trying to watch capital equipment investments.
Product/Service 2009-03-02 |
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Solder Paste Inspection and Management: SP50 Series 3 XL [Discontinued]
Building large boards? This platform provides users with all the capabilities of the SP50 series 3 but can handle boards up to 23.5x23.5” in size with capability to expand to handle even larger.
Product/Service 2009-03-02 |
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SJ50 Series 3 [Discontinued]
With the head swap capability to convert from a component inspection system to a 3D paste inspection system, this is an ideal solution for users who are trying to watch capital equipment investments.
Product/Service 2009-03-02 |
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