Medalist x6000 Automated X-ray Inspection System

• Total panel test cycle time: 32.3 cm2/sec (5 in2/sec) [Max].
• Joint pitch : 0.3 mm & up (0.012 in & up).
• Maximum panel size : 457 mm x 609 mm (18.0 in x 24.0 in).
• Algorithm that test SMT, pin-through-hole and pressfit components. View our full list of algorithm capability.
• Cross-sectional X-ray images of solder joints using digital tomosynthesis.

The Medalist x6000 Automated X-ray Inspection system delivers reduced conversion costs with high defect coverage at throughput rates that match line rates of most medium to high complexity boards

Benefits

• Industry leading 3D inspection delivering reduced conversion costs, reduced capital expenditure and up to 95% defect coverage
• Offers extensive simultaneous 3D X-ray Inspection of double-sided panels at throughput rates that match most line rates of medium to high complexity printed circuit boards
• Designed for in-line or off-line automated X-ray process testing of lead or lead-free solder joints of PCBA’s, with user configurable pass-thru or pass-back loading
• Enables successful implementations through easy-to-learn and easy-to-use development environment providing faster time-to-market with high quality results

To learn more, request additional information product information.

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