Medalist 5DX Automated X-Ray Inspection

• Total Test speed : 80 to 140 joints/second (approximately 1.0 in2/sec).
• Maximum panel size : 457 mm x 609 mm (18.0 in x 24.0 in).
• Joint pitch : 0.3 mm & up (0.012 in & up) (Model 5300), 0.2 mm & up (0.008 in & up) (Model 5400).
• Algorithm that test SMT, pin-through-hole and pressfit components. View our full list of algorithm capability.
• Digital cross-sectional X-ray images of solder joints using mechanical laminography.

The 5DX Automated X-ray Inspection system provides 3D X-ray inspection for both in-line and off-line operations. It helps cut costs and protect your margins in manufacturing environments where complexity is a driving factor and defect tolerance is narrow.

Benefits

• 3D X-ray inspection capability of both sides of a double-sided panel in one pass.
• Designed for in-line or off-line automated process testing of solder connections on printed circuit board assemblies, with pass-thru or pass-back loading.
• Designed with ease-of-use in mind.
• Time to production is typically under a day for an experienced user for programming an entire panel.

To learn more, request additional information product information.

Looking for software patches, find it in Technical Support –> Drivers & Software.