Limited Access Test Solutions

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In an ever-shrinking world, where smaller products, shorter life cycles, and tighter budgets are re-defining the way you do business. Agilent Dynamic Test Access Suite provides automatic test and fixturing solutions for smaller geometric and crowded boards addressing the severe access problems in ICT.

Here are just a few technologies that can help you get greater coverage with fewer pins. Agilent Interconnect Plus Boundary Scan on the Agilent 3070 improves testability of increasingly complex devices. Agilent's boundary-scan solutions provide a fast, automated pass/fail test along with pin-level diagnostics for speedy repair. Agilent/HP was one of the major pioneers in the world of boundary-scan, for example, we invented the BSDL standard. Automated Silicon Nails takes the IEEE 1149.1 one-step further by using boundary-scan chains to automatically test non-boundary-scan devices. Agilent DriveThru allows you to verify the existence of series termination components using existing Agilent TestJet technology probes. MagicTest automatically generates cluster tests for passive analog components, while providing diagnostics down to the component level. Agilent Access Consultant uses analysis data gathered with Agilent Magic Test, Agilent Interconnect Plus Boundary Scan and other tools in the Agilent 3070 test arsenal to guide you in the most efficient deployment of probes.

The Agilent AwareTest technology allows you to achieve broader test coverage, lower costs, improved efficiency and faster time to market by linking multiple test cells on the manufacturing floor. Agilent AwareTest xi combines the ICT and AXI technologies into a simple integrated effort for increased fault coverage even as board complexity increases and nodal access disappears.

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  • Access Consultant Access Consultant
    Software that ties all the different limited-access tools together to let you better manage which strategy suits your needs better
  • Bead Probe Technology Bead Probe Technology
    Increase test access even on high-speed traces and space-constrain PCBAs. Its layout independent nature means that trace-routing is not disrupted with the addition of bead probes unlike how test pads do
  • Cover-Extend Technology Cover-Extend Technology
    Hybrid technology between the VTEP vectorless capacitive coupling technology and boundary scan.
  • DriveThru DriveThru
    Used in conjunction with VTEP, DriveThru gives the user the ability to test both a device pin and the passive component leading to the device pin with just 1 test point
  • IEEE 1149.1 InterconnectPlus Boundary Scan IEEE 1149.1 InterconnectPlus Boundary Scan
    Compliant to the IEEE 1149.1 standard, this Agilent boundary-scan solution provide a fast, automated pass/fail test along with pin-level diagnostics for speedy repair.
  • IEEE 1149.6 Boundary Scan IEEE 1149.6 Boundary Scan
    Extend boundary scan to test high-speed AC-coupled differential signals in accordance to IEEE
  • Silicon Nails Silicon Nails
    Test non-boundary scan devices by using devices which are boundary scan-enabled to act as driver/receivers.