|
|
|
Agilent EEsof EDA Customer Education and Services
Brief overview of Agilent EEsof EDA Customer Education and Services.
|
2009-01-22
|
訓練教材
|
|
|
|
|
Agilent Wireless Test & Design World 2009 in Seoul, Korea
Agilent EEsof EDA related materials presented at the Agilent Wireless Test & Design World 2009
|
2009-07-01
|
研討會講義
|
|
|
|
|
MMIC/RFIC Packaging Challenges
Originally broadcast July 28, 2009; 9:00 am PT
|
|
網路廣播 -- 存檔
|
|
|
|
PDF
3.79 MB
|
MMIC/RFIC Packaging Challenges Slides
These slides cover several applications including the Agilent custom TOPS package, Agilent QFN package, solder bumps for FC package, Balun & mixer IC module, and RFIC PA co-design.
|
2009-08-26
|
研討會講義
|
|
