E5311A-A01 ASUR Reliability Test Structure Library (ASUR PDQ-FAB™)

ASUR PDQ-FAB™ is comprised of reliability structures optimized for highly accelerated (fast) DC WLR testing and is meant to be used with the ASUR test software family. More than 40 structures are available for failure mechanisms including electromigration (EM), contact EM and junction spiking, via EM, step coverage, oxide breakdown, plasma damage, mobile ions and hot-carrier degradation. These WLR structures can be placed in the scribe lanes between product ICs for production or used as development drop-ins and are available in either GDSII or CIF electronic formats. A unique and comprehensive design manual with physics-based design rules is also included with the structure suite. These structures have been successfully implemented in technologies from below 0.18um to above 1um. They have been used to reduce the reliability test time by more than a factor of 10. The structures are provided scaled to the customers' process technology or in a scaleable design rule set. PDQ-FAB™ includes more than 40 structures which permit fast and accurate reliability characterization and control of:

• Oxide Integrity: area, field-oxide, implant-edge intensive and full topography
• Electromigration: Fast and accurate constant temperature structures. Includes bamboo as well as grain boundary electromigration structures
• Step Coverage: Impact of metal thinning and quantitative determination of step coverage
• Via Electromigration: upper via surface, lower via surface and both surfaces with special thermal design rules
• Contact Electromigration: Also includes junction spiking
• Electromigration with Polysilicon heater
• Stress Void Detection
• Hot-Carrier Degradation: Lifetime, Trapped Charge, Interface States
• Plasma Damage: fast and accurate detection and isolation process-induced plasma damage including area and edge-intensive antennas at various layers and protection devices isolated from damage with interconnects and/or diodes
• Mobile Ions: Fast detection and identification of mobile ions
• Self-Heated Mobile Ions: Fast test without hot chuck using polysilicon heater
• C-V

_{^{PDQ-FAB™ is a trademark of Core Wafer Systems}}

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