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PDF
3.08 MB
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3D X-ray Tests and Analyses of Lead-Free PBGA (Plastic Ball Grid Array) Package Solder Joints
Presented at SMTA International Conference, Chicago, September 26-29, 2004
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2004-09-26
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Promotional Materials
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EXE
4.63 MB
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Agilent Medalist Family Demonstration
See how Agilent provides you with Solutions for Success in a Changing World.
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2005-02-22
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Demo
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PDF
480 KB
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CCGA Lead-Free Study
Reliability Testing and Data Analysis of an 1657CCGA (Ceramic Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards).
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2004-06-04
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Promotional Materials
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PDF
65 KB
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Characterizing new soldering processes – An experimental methodology for process optimization
Written by Glen Leinbach and Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, July 2005
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2005-12-05
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Article Reprint
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Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.
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2004-10-01
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Article Reprint
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XLS
39 KB
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Lead-Free Cost Savings Analysis
This cost-savings calculator shows savings when deploying test on lead-free, as well as VTEP cost savings when compared to TestJet.
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2005-09-09
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Application Note
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PDF
77 KB
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Overcoming Lower Wetting Forces of Lead-Free Alloys
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, March 2005.
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2005-12-05
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Article Reprint
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PDF
88 KB
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Pb-Free PCB Finishes for ICT - New solders can mean new finishes. How to decide which is best.
Written by Stig Oresjo and Chris Jacobsen, Agilent Technologies. Article published in Circuits Assembly, September 2005.
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2005-12-05
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Article Reprint
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PDF
75 KB
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Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.
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2005-12-05
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Article Reprint
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PDF
74 KB
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Putting Pb-Free to the Test - Why AOI and SPI are vital to upfront process control and verification.
Written by Stig Oresjo, Thorsten Niermeyer & Stacy Johnson, Agilent Technologies. Article published in Circuits Assembly, May 2005.
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2005-12-05
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Article Reprint
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WMF
19.2 MB
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Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Agilent Medalist Family of test and inspection systems.
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2005-03-14
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Success Story
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PDF
57 KB
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Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.
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2005-12-05
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Article Reprint
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Solutions Knowledge Base
This dynamic knowledge base of Agilent technical support content provides you with easy access to valuable information so you can troubleshoot problems, increase system efficiencies, and potentially resolve system uptime issues.
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2009-09-03
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Application Note
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PDF
214 KB
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Study and Recommendations Into Using Lead Free PCBs at In-Circuit Test
ICT relies on good contact between the test probe and test pad. On OSP boards, it is important that the stencil allows solder paste to be applied to testpoints.
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2005-06-09
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Promotional Materials
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PDF
421 KB
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Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.
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2005-02-22
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Application Note
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PDF
260 KB
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The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.
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2004-08-20
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Application Note
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PDF
1.22 MB
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The Transition to Lead-Free: Lead-Free Soldering and the 5DX
Presentation from the 2005 5DX Users Conference covering lead-free status worldwide, lead-free defects, test strategy considerations, lead-free test and inspection studies, 5DX lead-free confirmation and adjustment panel.
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2005-03-02
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Promotional Materials
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PDF
1.95 MB
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Update of Global Trends in Lead-Free Soldering
Presented at SMTA International Conference, Chicago, September 26-29, 2004
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2004-09-26
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Promotional Materials
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PDF
102 KB
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Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.
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2004-08-08
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Application Note
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PDF
44 KB
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“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test
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2006-02-07
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Application Note
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