Medalist 5DX Automated X-Ray Inspection
| Product Status: | Discontinued | Currently Supported |
|---|---|
| Supported Until: | 31 March 2016 |
This product is no longer available
No replacement found for this product.
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- Specifications (1)
- Manuals (11)
- Application Notes (44)
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1-25 of 76
| Diagnostic Testing and the Medalist 5DX Automated X-ray Inspection System
Users of the Medalist 5DX automated x-ray inspection system can benefit from running diagnostic tests on a regular basis. This application note provides some guidelines.
Application Note 2009-01-14 |
PDF
188 KB
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| codeNexus - Defect Reporter
Defect Reporter enchancement for the Medalist 5DX Automated X-ray Inspection System
Application Note 2008-09-26 |
PDF
764 KB
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| Setting Up HotKeys for AXI products on the Agilent Medalist Repair Tool
Users of the Agilent Medalist Repair Tool, also known as the Agilent Repair Tool (ART), can setup hot keys to increase the efficiency of image viewing in RT4.0 for their X-ray inspection products.
Application Note 2008-09-26 |
PDF
629 KB
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| Build Operator Menu: Multiple Menu Configuration Control for 5DX Auto User Interface
The "Build Operator Menu" software replaces and extends the functionality found in the BLDOPMNU DOS command. This application note provides useful user information about this menu.
Application Note 2008-09-04 |
PDF
849 KB
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| Quad Flat No Lead (QFN) Best Practices
The purpose of this application note and best practices guide is to describer the QFN-type component and provide testing methods to ensure robust testing on the Medalist 5DX Automated X-ray Inspection (AXI) System.
Application Note 2008-08-26 |
PDF
492 KB
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| Using the FET Algorithm on the Medalist 5DX AXI to Analyze Non-Standard Joints
A new algorithm family called FET for the Agilent Medalist 5DX automated X-ray inspection (AXI) system helps users to effectively analyze non-standard joints for insufficient or no solder, non-reflowed or cold solder, and excessive voiding.
Application Note 2008-07-01 |
PDF
553 KB
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| Adjusting the X-ray Surface Map parameters on the Medalist 5DX Automated X-ray System
Tips on obtaining the best images using the 5DX surface map parameters.
Application Note 2008-06-19 |
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| Adjusting the Defect Analyzer detection parameters on the Medalist 5DX Automated X-ray System
Defect Analyzer operates by making a small change in the ‘z’ height of the board and re-testing suspect joints.
Application Note 2008-06-12 |
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| Agilent 5DX operation manual
This is a operation manual that describes the safety and operation for 5DX
Operation Manual 2008-06-01 |
PDF
638 KB
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| Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy, good knowledge of defect levels and test effectiveness are two very important factors to include. This paper presents data from a 2007 study of 3.7 billion solder joints. Reprinted with permission from IPC.
Article 2008-05-21 |
PDF
118 KB
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| Article reprint: Impact of Quad Flat No Lead Package (QFN) on Automated X-ray Inspection (AXI)
This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.
Article 2008-03-06 |
PDF
1.62 MB
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| How CAD Data and Threshold Settings Affect Pin Length on the Agilent Medalist 5DX
This application note describes the effects of CAD data and threshold settings on pin lengths while working on the Medalist 5DX Automated X-Ray Inspection system.
Application Note 2008-02-22 |
PDF
124 KB
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| Comparing CAD and BOM data for 5DX Use
Instructions for comparing CAD and BOM data to quickly deal with no load components.
Application Note 2008-01-04 |
PDF
1.16 MB
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| Xray Choices for SMT Manufacturing
In many cases, there is a complementary choice of automated 3D X-ray and off-axis 2D X-ray inspection. This article explores this concept. Published with kind permission from SMT
Article 2007-11-01 |
PDF
188 KB
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| Tips for X-ray Users On Exporting NDF’s With No Loads Set To False
Navigating CAD can be a time consuming process. Small tips can be extremely helpful in creating quality programs in a short amount of time.
Application Note 2007-10-18 |
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| X-ray Test Users Utilize BOM Explorer to Change
Automated X-ray Inspection 5DX Users can save time by implementing these quick and easy steps to use BOM explorer to change "no pops" to "untested".
Application Note 2007-10-12 |
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| Defect-Detection Strategies
Written by James Benson. Published with permission from Circuits Assembly, May 2007.
Article 2007-08-11 |
PDF
985 KB
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| Evolving Packages Drive Test and Inspection
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, March 2007
Article 2007-08-11 |
PDF
747 KB
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| 5DX users benefit from configuring Automatic Reporter
Agilent Medalist 5DX Automated X-ray Inspection users can avoid the hassle of stopping Automatic Reporter and deleting those .res files and image folders every time a fine tune of a program is done.
Application Note 2007-06-20 |
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| 5DX Automated X-ray Inspection Software Internal Error Notification Tool AN
This application note describes the Initial installation, Configuration changes, and Operation of the 5DX Automated X-ray Inspection Software Internal Error Notification Tool.
Application Note 2007-04-23 |
PDF
371 KB
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| Save Time – Create a Defect Log on Each Board Tested with the 5DX Automated X-ray Inspection System
This App Note shows you how to create a defect log for 5DX AXI System
Application Note 2007-03-16 |
PDF
205 KB
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| Quad Flat No-Lead (QFN) Application Note and Best Practices
This document provides details on QFN component test methodology and best practices to ensure robust testing and quality results. The QFN algorithm was introduced in 5DX software version 8.4, and enhanced and simplified in patch version 8.4.1.
Application Note 2007-01-31 |
PDF
1.05 MB
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| Life and Stability of the Agilent 5DX Sealed X-ray Tube
Agilent has developed a sealed ultra-high vacuum X-ray tube that provides stable output throughout a significantly long life.
Application Note 2007-01-22 |
PDF
78 KB
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| Ball Grid Array Joint Inspection Using X-ray as it relates to voids and the IPC-7095A specification
With the introduction of Lead-free solder, voiding within Ball Grid Array (BGA) joints is potentially a major issue. This article discusses the relationship to voiding, the IPC standard and Automated X-ray Inspection.
Feature Story 2006-12-22 |
PDF
615 KB
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| Understanding the Corrected Gray Level Measurement in the PTH2 Algorithm for the 5DX Automated X-ray
The PTH2 Algorithm family has enabled many customers to dramatically reduce false calls and increase test effectiveness on plated through-hole joints. This note assists with understanding the key questions associated with this algorithm family.
Application Note 2006-12-12 |
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