In-circuit Test Systems - 3070 ICT
Agilent offers leading board test solutions for electronics manufacturers to tackle a wide range of PCBA test access and coverage issues for today’s complex printed circuit assemblies.
Improve both board test coverage and test throughput at in-circuit test with i3070 and i1000D ICT systems that offer one of the best ROICs available in the market today.
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176-200 of 255
| ITF 3.1 File Directory Structure
This concise document provides information on the ITF3.1 File directory structure on the ITF server, Tester and Client applications (ART & AQT viewers).
User Manual 2005-04-04 |
PDF
146 KB
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| ITF 3.1 Server Setup Guide
This guide provides a step-by-step procedure on how to set up your own File Server, starting with installing the OS, MS SQL and finally MTSS ITF software using a Compaq ML370 Server as an example.
Installation Manual 2005-04-01 |
PDF
884 KB
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| ITF 3.1 Setup Guide
Provides instructions on how to install and configure the Intelligent Test Framework Server and ART/AQT Viewer Client applications.
Installation Manual 2005-04-01 |
PDF
2.83 MB
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| Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Agilent Medalist Family of test and inspection systems.
Case Study 2005-03-14 |
WMF
19.21 MB
|
| Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.
Application Note 2005-02-22 |
PDF
421 KB
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| ART 3.1 User Guide
This user guide offers simple tips on how to use ART for different operating needs.
User Manual 2005-02-01 |
PDF
3.77 MB
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| AQT 3.1 User Guide
This user guide offers simple tips on how to use AQT for different operating needs.
User Manual 2005-02-01 |
PDF
3.23 MB
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| ITF 3.1 Reference Guide
Provides useful information to help user select and configure the file storage system, backup and restore data on the ITF server, how to configure the communication ports, troubleshooting network issues and more.
User Manual 2005-01-10 |
PDF
689 KB
|
| ITF 3.1 User Guide
Updated user guide for Intelligent Test Framework Software Solutions, Revision 3.1.
User Manual 2005-01-01 |
PDF
2.56 MB
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| ITF 3.1 Upgrade Guide
For those intending to upgrade to ITF 3.1 from the ITF 3.0 platform, this guide is a step-by-step platform migration procedure.
Installation Manual 2005-01-01 |
PDF
1.23 MB
|
| Traceable Calibration for 3070
As test equipment ages, system performance degrades. Agilent can help protect your investment with NIST traceable system calibration.
Feature Story 2004-12-13 |
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| Medalist Quality Tool (Formerly AQT) Optimization Guide
This guide offers simple tips on how to use AQT for different operating needs.
User Manual 2004-10-22 |
PDF
1.11 MB
|
| VTEP ROI Analysis
Discover how VTEP compares to existing technologies that are already in use worldwide.
Application Note 2004-10-04 |
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| VTEP Coverage Analysis
How much additional coverage can you really get with VTEP? The VTEP Coverage Analysis Tool provides a realistic estimate.
Application Note 2004-10-04 |
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| Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.
Article 2004-10-01 |
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| Safeguard and Low Voltage
Documents summarizing issues regarding the testing of low voltage devices on the 3070 and i5000, including updated Safeguard information.
Application Note 2004-08-30 |
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| The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.
Application Note 2004-08-20 |
PDF
260 KB
|
| Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.
Application Note 2004-08-08 |
PDF
102 KB
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| CCGA Lead-Free Study
Reliability Testing and Data Analysis of an 1657CCGA (Ceramic Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards).
Promotional Materials 2004-06-04 |
PDF
480 KB
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| Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").
Case Study 2004-05-26 |
PDF
53 KB
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| Vectorless Test EP (VTEP) Goes Head-to-Head with Agilent TestJet
In beta tests, VTEP proved its abilities to improve in-circuit test coverage by over 80 percent compared to Agilent TestJet, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.
Case Study 2003-12-16 |
PDF
351 KB
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| 3070 05.31: PDU/POD Upgrade
Describes how to install the E1135C PDU and Pod upgrade.
Installation Manual 2003-12-01 |
PDF
670 KB
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| Medalist Quality Tool Datasheet
AQT provides statistical quality control and statistical process control analysis for Agilent test systems.
Data Sheet 2003-11-01 |
PDF
626 KB
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| Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Agilent to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.
Case Study 2003-10-24 |
PDF
600 KB
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| Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.
Article 2003-10-01 |
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