Technical Support:
U9820A Agilent Nano Indenter G200

Product Status: Currently Orderable | Currently Supported
Product Upgrades: Contact Agilent for details

FAQs

Refine the List

  • no refinements available

1-12 of 12

Sort:

Results

Title/Description Date Type
Can you please explain to me the Strain Rate Target input in determining the rate at which the indenter penetrates the surface? I am using the XP CSM Standard and XP Basic Hardness and Modulus at a Depth methods, and I am trying to understand how the strain rate translates into the loading rate of the indent. What is the strain measurement? How does it translate to nm/s? I see that the load rate changes over the time course. What is the reasoning behind this method design?
The Strain Rate Target input is used so that the indenter loads at a rate that is equivalent to the user’s desired target strain rate for their material. This is an important parameter for time-dependent materials since their mechanical properties can change as a function of strain rate...
2009-10-11 FAQ
How do I implement the correction of Pharr, Strader, and Oliver in an older test method?
In a recent special-focus issue of the Journal of Materials Research, Pharr, Strader, and Oliver demonstrated that in some circumstances, the oscillation amplitudes of the CSM option have non-negligible effects on the semi-static measurements of force and displacement...
2009-10-11 FAQ
How is displacement range affected when changing gain value?
NanoSuite Explorer gives the user the ability to change gain settings to fit specific testing needs. Each gain setting, 0-7, has a corresponding displacement range...
2009-10-11 FAQ
My frame stiffness changed from 8.5e+6 N/m to 6.5e+6N/m. Is this a problem?
Because the contact and the frame are springs in series, this is not as big of a change as it seems. Let us consider the effect of this change on fused silica when the applied force is 400mN...
2009-10-11 FAQ
Unloading properties don’t calculate
The test seems to run fine, but none of the properties from the unload are calculated...
2009-10-11 FAQ
What is an appropriate flat punch diameter for my material?
The flat punch diameter used to test a material should generate a contact stiffness much greater then the stiffness of the springs in the indenter head. The standard stiffness of the springs in the XP indentation head is approximately 80N/m...
2009-10-11 FAQ
What is the area function for a spherical tip? How do I enter this into TestWorks.
The spherical tip function is the lead term, a0 is 0. The 2nd term, a1 is 2R, where R is tip radius in nm. The remaining terms are 0...
2009-10-11 FAQ
What is the noise floor for force and displacement?
The noise-floor values for displacement and force in our laboratory for the DCM head are <0.1nm and <10nN, respectively. For the XP head, these values are <1.0nm and <100nN. We do not quote values for noise floor, because they are not concrete values for the instrument. Rather, they are an accumulation of all noise sources, and thus, lab-dependent.
2009-10-11 FAQ
What is the nominal area function for a cone?
Given a cone with a half-included angle of...
2009-10-11 FAQ
What is the positional accuracy when moving between the XP and DCM heads? For example, say you need to make an indent with the XP and then scan with the new NanoVision with the DCM head. How accurate will my positional targeting be? Do you have to do anything other than microscope to indenter cal on both prior to switching between them?
The quoted accuracy for the XP stage (High Precision) is 1 micron within the field of view at a point that has been calibrated in Microscope to Indenter distance...
2009-10-11 FAQ
When I change grips on the Nano UTM, must I re-determine the mass for dynamic analysis?
No...
2009-10-11 FAQ
Why did beta change?
Historically, a “fudge-factor” beta has appeared in the equation that relates stiffness to reduced modulus...
2009-10-11 FAQ

1-12 of 12