W8614EP MBP Reliability Module MOSRA - TMI
Key Features & Specifications
- Supports MOSRA and TMI aging model generation and optimization
- Built-in extraction flow for MOSRA
- Supports the simulation and extraction of user-defined reliability model
The W8614EP Model Builder Program (MBP) Reliability Module MOSRA - TMI includes the extraction package for MOS Reliability Analysis (MOSRA) and the TSMC Model Interface (TMI) aging model.
The MBP Reliability Module offers an environment for MOSRA, which is capable of simulating the aging effects such as Hot Carrier Injection (HCI) and Bias Temperature Instability (BTI). The user can measure the device performance degradation over time and evaluate the stress effects.
Besides MOSRA, the MBP Reliability Module also supports the TMI aging model generation. TMI is a C-based modeling API developed to support extensions of standard compact models. The user can measure the device performance degradation over time and evaluate the stress effects for the process down to 40nm and beyond.
Return to Model Builder Program (MBP).
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